Andromeda XZU65 – Fresh from the Production Line

Finally the second member of the Andromeda System-on-Module family did arrive: the Andromeda XZU65. It's optimized for high-end applications and is equipped with 3 connectors offering 322 User-I/Os.

The Andromeda XZU65 module is suitable for high-speed applications and video applications thanks to the high number of transceivers, to the superior module connector performance and to the large bandwidth of the DDR channels. It's based on the Xilinx Zynq Ultrascale+ MPSoC ZU7EV/ZU11EG devices and the optimal solution for the most rugged and demanding applications. The SOM integrates up to 4 GByte fast DDR4 SDRAM with Error Correction Code (ECC), 16 GByte eMMC flash and 128 MByte quad SPI flash. For communication it offers PCIe Gen3 x16, Gigabit Ethernet PHY and USB 3.0 as well as 24 MGTs with up to 16.6 Gbit/sec – all on a tiny footprint of just 68 × 52 mm.

Get all the details: Andromeda XZU65

Mercury+ MP1: FPGA meets RISC-V

The Enclustra Mercury+ MP1 system-on-chip (SoC) module combines Microchip’s PolarFire SoC-series device with fast DDR4 ECC SDRAM, eMMC flash, SPI flash, dual Gigabit Ethernet PHY, USB 2.0 PHY. The System-on-Module (SoM) combines a low-power FPGA with a highly secure, 64 bit Quad-Core RISC-V CPU in a single plug-and-play platform.

With the PolarFire SoC based Mercury+ MP1 Enclustra is now offering System-on-Modules that are based on FPGA technologies from three different companies: AMD Xilinx, Intel & Microchip. With it's large product portfolio Enclustra is offering a module for almost every application and helps to shorten time-to-market and lower total cost of ownership (TCO).

Check out all the details or contact us to get more information about the Mercury+ MP1.

Meet Enclustra @Embedded Computing Conference

Get your embedded update at Embedded Computing Conference on May 31 2022, 9:00–18:00 in Winterthur. Take the chance and get all the latest FPGA and SoC news, lots of know-how and experience the power and ease of use of the Enclustra SoC modules on the Avnet Silica booth.

We look forward to welcoming you on May 31^st.

We Are Ready for the Move

We are excited to move to a new and larger office. Everything is ready for the move tomorrow. The additional office is located just one floor below in the same building at our headquarters in Zurich. Thanks to the move we triple the size of our office and are ready for future, continuous growth.

Meet Enclustra @FHNW Career Day

Are you looking for exciting projects, great team spirit, flexible work hours, international customers and unlimited free coffee & chocolate? Then visit us at FHNW Career Day 2022 and apply for one of our open jobs – or send us a spontaneous application. You find us in the Foyer at booth 44 on May 11 from 13:00 – 19:00.

We look forward to get to know you or to welcoming you at Enclustra.