Mercury ZX5

Xilinx® Zynq® 7015/7030 SoC Module

Mercury ZX5 SoC Module Mercury ZX5 SoC Module (Front)
Mercury ZX5 SoC Module (Back)

Upgrade to Xilinx Zynq UltraScale+ MPSoC

If you need a more powerful SoC module or want to upgrade your current Xilinx Zynq solution, then have a look at the Mercury XU5.


The Mercury ZX5 system-on-chip (SoC) module combines Xilinx's Zynq-7000-series All Programmable SoC device with fast DDR3 SDRAM, NAND flash, quad SPI flash, a Gigabit Ethernet PHY and an RTC and thus forms a complete and powerful embedded processing system.

The Mercury ZX5 SoC module reduces development effort, redesign risk and improves time-to-market for your embedded system.



  • Built around Xilinx's Zynq-7000 All Programmable SoC
  • Combines the flexibility of a CPU system with the parallel processing power and real-time capabilities of an FPGA system
  • Supports analog differential inputs
  • Available in industrial temperature range
  • Supports USB 2.0, CAN and Gigabit Ethernet
  • Linux BSP and tool chain available
  • Powerful and compact FPGA board
Enclustra Design Services


  • A complete and powerful embedded processing system in a compact form factor
  • 1 GB of high-bandwidth DDR3L SDRAM
  • PCIe Gen2 x4, Gigabit Ethernet and USB 2.0 interfaces, plus a high number of available LVDS pairs provide high-speed data I/O at low integration cost
  • Fast boot times and plenty of non-volatile memory space due to the NAND flash
  • Lowest power consumption due to the high-efficiency DC/DC converters
  • Support for Linux and VxWorks operating systems


  • Xilinx Zynq-7000-series SoC FPGA
    • ARM® dual-core Cortex™-A9
      (32 bit, up to 1000 MHz)
    • Xilinx Artix™-7/Kintex®-7 28nm FPGA fabric
  • Small form factor (56 × 54 mm)
  • 178 total user I/Os
    • 12 ARM peripheral I/Os (SPI, SDIO, CAN, I2C, UART)
    • 146 FPGA I/Os (single-ended, differential or analog)
    • 20 MGT signals (clock and data)
  • PCIe Gen2 x4
  • 4 × 6.25/6.6 Gbps MGT
  • Gigabit Ethernet and USB 2.0 OTG
  • 512 MB NAND flash
  • 64 MB quad SPI flash
  • 5 to 15V supply voltage

Module Architecture

Mercury ZX5 Module ArchitectureClick image to enlarge

Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.

Product Selection Matrix

Product CodeSoC FPGADDR3L SDRAMNAND FlashPCI ExpressTemp. RangeStatus
ME-ZX5-15-2I-D10 XC7Z015-2CLG485I 1024MB 512MB -40..+85°C
ME-ZX5-30-1I-D10 XC7Z030-1SBG485I 1024MB 512MB -40..+85°C
ME-ZX5-30-3C-D10 XC7Z030-3SBG485E 1024MB 512MB 0..+70°C else
Custom Models Click to view custom models options

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Key: in-stock Active limited-quantities Early Access contact-us Contact us

Minimum order quantities apply for custom module configurations. Please contact us.


Show prices in: EUR USD CHF CNY

Product CodePreferred model1EURUSDCHFWe provide CNY prices with 13% VAT, please contact our China sales.
1+30+100+1000+10000+1+30+100+1000+10000+1+30+100+1000+10000+ 我们在中国有分公司,提供人民币含税价,请联系

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1: For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.

Mercury Heat Sink

enclustra mercury heat sink hs3

Large Heat Dissipation

High performance devices like the Xilinx Zynq Ultrascale+ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.

The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.

The Mercury heatsink is provided as part of a heatsink accessory package including:

  • Heatsink body
  • Mounting material
  • Standard fan
  • Gap pad set

Design-in Kit – The Fast Way to the Market

enclustra design-in kit xu5

The Enclustra Design-in Kits help shorten time-to-market for any Xilinx Zynq UltraScale+ MPSoC based application. The design-in kits include everything you need to get started, also 2 AI example applications with all sources.

The examples are based on ResNet50 and Xilinx Vitis AI. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself. more

Base Boards

Select one of these base boards to get started with development straight out of the box.

Base BoardDescription
Mercury+ ST1 A flexible board optimized for video applications and the perfect fit for our Mercury and Mercury+ modules.
Mercury+ PE3 a versatile PCIe® base board equipped with a multitude of I/O interfaces compatible with all Mercury and Mercury+ modules. Especially suited for high-speed communication applications thanks to the QSFP+/SFP+ interfaces.
Mercury+ PE1 A feature-packed board with 3 different variants, compatible with all Mercury and Mercury+ modules.

Operating System Support

OS Details EBE BSP Petalinux BSP



Available now Available now



  • BSP support for:
    • DDR3 SDRAM
    • NAND flash
    • Quad SPI flash
    • UART
    • Gigabit Ethernet
  • U-boot bootloader
  • Software design services by NetModule
Contact NetModule for more info NetModule

Target Applications

  • Embedded Computing
  • Data Acquisition
  • High-Speed Communications
  • Drive/Motion Control
  • Digital Signal Processing
  • Image Processing

Related Products

  • Mercury+ ST1 Base Board more
  • Mercury+ PE1 PCIe Base Board more
  • Universal Drive Controller IP Core more



Support and Further Information

Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.