The Mercury+ XU6 system-on-chip (SoC) module combines Xilinx's Zynq UltraScale+™ MPSoC-series device with fast DDR4 ECC SDRAM, eMMC flash, quad SPI flash, Gigabit Ethernet PHY, dual USB 3.0 and thus forms a complete and powerful embedded processing system.
Highlights
Built around Xilinx's Zynq Ultrascale+™ MPSoC
DDR4 SDRAM with Error Correction Code (ECC)
Up to 19.2 GByte/sec memory bandwidth
Offers PCIe® Gen3 x4, PCIe Gen2 x4, 2x USB 3.0 and Gigabit Ethernet interfaces
Available in industrial temperature range
Three 168-pin Hirose FX10 connectors with up to 294 user I/Os
A complete and powerful embedded processing system in a compact, space-saving form factor
Large, high-bandwidth memory, with up to 8 GByte of DDR4 ECC SDRAM
High-bandwidth data transfer: PCIe® Gen3 x4, PCIe Gen2 x4 interfaces, and USB 3.0
Lowest power consumption due to the high-efficiency DC/DC converters
Support for Linux embedded operating system
Features
Xilinx® Zynq Ultrascale+™ MPSoC
ARM® dual-/quad-core Cortex™-A53
(64 bit, up to 1333 MHz)
ARM dual-core Cortex™-R5
(32 bit, up to 533 MHz)
Mali-400MP2 GPU (only for EG/EV models)
H.264 / H.265 Video Codec (only for EV models)
16nm FinFET+ FPGA fabric
Up to 8 GB DDR4 ECC SDRAM (PS side)
16 GB eMMC flash
64 MB QSPI flash
Up to 8 × 6/12.5 Gbps MGT
PCIe Gen2 ×4
PCIe® Gen3 ×4 (only devices larger than ZU3)
Gigabit Ethernet
2× USB 2.0/3.0 (host & host/device) or alternatively 1× USB 2.0 OTG
Up to 256,000 system logic cells
Up to 294 user I/Os
ZU2CG/ZU2EG/ZU3EG:
14 ARM peripherals
240 FPGA I/Os
20 MGT signals (clock and data)
ZU4CG/ZU4EV/ZU5EV:
14 ARM peripherals
240 FPGA I/Os
40 MGT signals (clock and data)
5–15 V supply
65 × 54 mm
Module Architecture
Click image to enlarge
1. MGTs and PCIe support only for FPGA devices larger than ZU3
Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.
Product Selection Matrix
Product Code
MPSoC
DDR4 ECC SDRAM (PS)
DDR4 ECC
eMMC
Temp. Range
Status
ME-XU6-2CG-1E-D10H1
XCZU2CG-1SFVC784E
1GB
16GB
0..+85°C
ME-XU6-2EG-1I-D13E
XCZU2EG-1SFVC784I
8GB
✔
16GB
-40..+85°C
ME-XU6-3EG-2I-D11
XCZU3EG-2SFVC784I
2GB
16GB
-40..+85°C
ME-XU6-4CG-1E-D12
XCZU4CG-1SFVC784E
4GB
16GB
0..+85°C
ME-XU6-4EV-1I-D12
XCZU4EV-1SFVC784I
4GB
16GB
-40..+85°C
ME-XU6-5EV-2I-D12E
XCZU5EV-2SFVC784I
4GB
✔
16GB
-40..+85°C
Custom Models
Click to view custom models options
TBC
TBC
TBC
TBC
TBC
Click on table to enlarge
1: This model supports only half of the DDR4 bandwidth on the PS side (32-bit interface instead of 64-bit).
Key:
Active
Early Access
Contact us
Minimum order quantities apply for custom module configurations. Please contact us.
We provide CNY prices with 13% VAT, please contact our China sales.
1+
30+
100+
1000+
10000+
1+
30+
100+
1000+
10000+
1+
30+
100+
1000+
10000+
我们在中国有分公司，提供人民币含税价，请联系kiddy.xu@enclustra.com
ME-XU6-2CG-1E-D10H
✔
355
317
284
258
221
366
327
293
266
228
344
308
276
250
214
ME-XU6-2EG-1I-D13E
✔
701
605
530
489
424
723
624
547
504
437
680
587
514
474
411
ME-XU6-3EG-2I-D11
780
675
591
546
458
805
696
610
563
472
757
655
574
530
444
ME-XU6-4CG-1E-D12
✔
635
549
481
442
359
655
566
496
456
370
616
532
466
429
348
ME-XU6-4EV-1I-D12
905
767
662
611
506
934
791
683
630
522
878
744
642
593
491
ME-XU6-5EV-2I-D12E
✔
1369
1126
955
877
719
1412
1162
985
905
742
1328
1093
926
851
698
Click on table to enlarge
1: For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.
Mercury Heat Sink
Large Heat Dissipation
High performance devices like the Xilinx Zynq Ultrascale+ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.
The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.
The Mercury heatsink is provided as part of a heatsink accessory package including:
Heatsink body
Mounting material
Standard fan
Gap pad set
Design-in Kit – The Fast Way to the Market
The Enclustra Design-in Kits help shorten time-to-market for any Xilinx Zynq UltraScale+ MPSoC based application.
The design-in kits include everything you need to get started, also 2 AI example applications with all sources.
The examples are based on ResNet50 and Xilinx Vitis AI. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself.
more
Base Boards
Select one of these base boards to get started with development straight out of the box.
a versatile PCIe® base board equipped with a multitude of I/O interfaces compatible with all Mercury and Mercury+ modules. Especially suited for high-speed communication applications thanks to the QSFP+/SFP+ interfaces.
Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.
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Active
Early Access
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