The Mercury+ XU6 system-on-chip (SoC) module combines Xilinx's Zynq UltraScale+™ MPSoC-series device with fast DDR4 ECC SDRAM, eMMC flash, quad SPI flash, Gigabit Ethernet PHY, dual USB 3.0 and thus forms a complete and powerful embedded processing system.
Highlights
Built around Xilinx's Zynq Ultrascale+™ MPSoC
DDR4 SDRAM with Error Correction Code (ECC)
Up to 19.2 GByte/sec memory bandwidth
Offers PCIe® Gen3 x4, PCIe Gen2 x4, 2x USB 3.0 and Gigabit Ethernet interfaces
Available in industrial temperature range
Three 168-pin Hirose FX10 connectors with up to 294 user I/Os
A complete and powerful embedded processing system in a compact, space-saving form factor
Large, high-bandwidth memory, with up to 8 GByte of DDR4 ECC SDRAM
High-bandwidth data transfer: PCIe® Gen3 x4, PCIe Gen2 x4 interfaces, and USB 3.0
Lowest power consumption due to the high-efficiency DC/DC converters
Support for Linux embedded operating system
Features
Xilinx® Zynq Ultrascale+™ MPSoC
ARM® dual-/quad-core Cortex™-A53
(64 bit, up to 1333 MHz)
ARM dual-core Cortex™-R5
(32 bit, up to 533 MHz)
Mali-400MP2 GPU (only for EG/EV variants)
H.264 / H.265 Video Codec (only for EV variants)
16nm FinFET+ FPGA fabric
Up to 8 GB DDR4 ECC SDRAM (PS side)
16 GB eMMC flash
64 MB QSPI flash
Up to 8 × 6/12.5 Gbps MGT
PCIe Gen2 ×4
PCIe® Gen3 ×4 (only devices larger than ZU3)
Gigabit Ethernet
2× USB 2.0/3.0 (host & host/device) or alternatively 1× USB 2.0 OTG
Up to 256,000 system logic cells
Up to 294 user I/Os
ZU2CG/ZU2EG/ZU3EG:
14 ARM peripherals
240 FPGA I/Os
20 MGT signals (clock and data)
ZU4CG/ZU4EV/ZU5EV:
14 ARM peripherals
240 FPGA I/Os
40 MGT signals (clock and data)
5–15 V supply
65 × 54 mm
Module Architecture
Click image to enlarge
1. MGTs and PCIe support only for FPGA devices larger than ZU3
Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.
Product Selection Matrix
Product Code
MPSoC
DDR4 ECC SDRAM (PS)
DDR4 ECC
eMMC
Temp. Range
Status
ME-XU6-2CG-1E-D10H
XCZU2CG-1SFVC784E
1GB
16GB
0..+85°C
ME-XU6-2EG-1I-D13E
XCZU2EG-1SFVC784I
8GB
✔
16GB
-40..+85°C
ME-XU6-3EG-2I-D11
XCZU3EG-2SFVC784I
2GB
16GB
-40..+85°C
ME-XU6-4CG-1E-D12
XCZU4CG-1SFVC784E
4GB
16GB
0..+85°C
ME-XU6-4EV-1I-D12
XCZU4EV-1SFVC784I
4GB
16GB
-40..+85°C
ME-XU6-5EV-2I-D12E
XCZU5EV-2SFVC784I
4GB
✔
16GB
-40..+85°C
Custom Configurations
Click to view custom configuration options
TBC
TBC
TBC
TBC
TBC
Click on table to enlarge
Key:
Mass production
Sampling
Contact us
Minimum order quantities apply for custom module configurations. Please contact us.
We provide CNY prices with 13% VAT, please contact our China sales.
1+
30+
100+
1000+
10000+
1+
30+
100+
1000+
10000+
1+
30+
100+
1000+
10000+
我们在中国有分公司，提供人民币含税价，请联系kiddy.xu@enclustra.com
ME-XU6-2CG-1E-D10H
✔
253
226
202
183
155
299
267
239
216
183
278
248
222
201
170
ME-XU6-2EG-1I-D13E
✔
540
467
409
375
327
638
551
483
443
386
594
513
449
412
359
ME-XU6-3EG-2I-D11
549
474
416
382
318
648
560
491
451
376
603
521
457
420
350
ME-XU6-4CG-1E-D12
✔
455
393
344
314
255
537
464
406
371
301
500
432
378
345
280
ME-XU6-4EV-1I-D12
640
542
468
429
355
756
640
553
507
419
704
596
515
472
390
ME-XU6-5EV-2I-D12E
✔
960
790
670
612
501
1134
933
791
723
592
1055
868
736
673
551
Click on table to enlarge
1: For non-preferred configurations, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.
Mercury Heat Sink
Large Heat Dissipation
High performance devices like the Xilinx Zynq Ultrascale+ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.
The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.
The Mercury heatsink is provided as part of a heatsink accessory package including:
Heatsink body
Mounting material
Standard fan
Gap pad set
Design-in Kit – The Fast Way to the Market
The Enclustra Design-in Kits help shorten time-to-market for any Xilinx Zynq UltraScale+ MPSoC based application.
The design-in kits include everything you need to get started, also 2 AI example applications with all sources.
The examples are based on ResNet50 and Xilinx Vitis AI. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself.
more
Base Boards
Select one of these base boards to get started with development straight out of the box.
Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.
For commercial reasons, this file is only available to Enclustra customers - if you're already a customer, simply fill in your name, company and email address below and we'll send you the file as soon as possible (usually within 24 hours).
If you're not currently a customer, we'd appreciate if you could provide a short message about your project requirements, and anything else we can assist you with.
Document Request
After filling out your contact details you will get an Email with a download link.
If you're not currently a customer, we'd appreciate if you could provide a short message about your project requirements, and anything else we can assist you with.
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Mass production
Sampling
Contact us
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