Mars Heat Sinks

The Mars heat sink is an optimal solution to cool Mars FPGA and SoC modules – it's low profile (less than 7 mm tall) and covers the whole module surface. It comes with a thermal gap pad for the FPGA and four screws to attach it to the module PCB. With additional user configured thermal gap pads, it is possible to cool other components on the board as well. To cool the module even further, a mounting slot in the center of the heat sink makes it easy to attach fans of different sizes – see the technical drawing for details.

Fan for Mars XU3 Heat sink

For the Mars XU3 SoC module in addition to the heat sink a fan is recomended (ACC-FAN-KIT-25X25-5V/Fan Kit for Mars XU3 Heat sink). The fan is bundled with two screws and nuts to mount it directly on top of the heat sink. Please add the fan kit when you order the module and heat sink.