Enclustra FPGA Solutions | EAP Andromeda XRU50 Design-in Kit |

EAP Andromeda XRU50 Design-in Kit

EAP Andromeda XRU50 Design-in Kit

The Enclustra EAP Andromeda XRU50 Design-in Kit includes the Andromeda XRU50 RFSoC module, Neso RF front end, Baseboard, and accessories. The Design-in Kit allows you to experience our latest Andromeda XRU50 module and to fully validate our module for your application.

The Andromeda XRU50 RFSoC module provides remarkable RF performance in an integrated and compact, power-efficient package for next-generation RF systems. This module is in the most compact form factor available on the market today, delivering exceptional RF performance without compromise and offering unparalleled flexibility for diverse applications.

The EAP Andromeda XRU50 Design-in Kit offers a complete system including all required hardware, accessories, and support materials, to make it a seamless “plug-and-play” experience.

What's Inside the Box

  • Enclustra AMD’s Zynq Ultrascale+ RFSoC FPGA system-on-module/SOM
  • Base board
  • Neso RF front end
  • Adapters
  • Heatsink
  • Fan
  • Power supply
  • RF cables
  • SMP terminators
  • Micro SD card with example design
  • Example applications
  • Quick start guide

Available Resources

  • Master pinout
  • Connector/Footprints
  • 3D model
  • RF performance report
  • User Schematics
  • Design support
  • Example design to get started


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Product Code Status

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1: Quantity per customer is limited to 2 kits per year.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.

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Neso RF Front End

The Neso front end allows for interfacing the RF capabilities of the FPGA modules with ease.

Key Features:

  • 22 x RF SMP-Connectors: For high-quality RF signal transmission and reception.
  • Clock Management: Includes dedicated ports for RF clock signals, SYSREF signals, and an on-board ultra-low phase noise 500 MHz oscillator.
Advantages of the RFF02 Front-End Board:
  • Rapid Prototyping: Accelerates the development cycle of RF-based systems.
  • Flexibility: Adaptable to a wide range of RF applications and requirements.
  • High Performance: Ensures high-quality signal transmission.



Support and Further Information