Mars AX3

Xilinx® Artix®™-7 28nm FPGA Module

Mars AX3 FPGA Module Mars AX3 FPGA Module (Front)
Mars AX3 FPGA Module (Back)

Overview

The Mars AX3 FPGA module is equipped with a powerful, low-cost Xilinx Artix-7™ 28nm FPGA, Gigabit Ethernet, and fast DDR3 SDRAM, making it perfectly suited for high-speed communication and DSP applications.

The SO-DIMM form factor allows space-saving hardware designs, and speedy, simple integration of the FPGA board into the target application.

 

Highlights

  • Low-cost, low-power FPGA of the latest generation
  • 35k-100k logic cells, 40k-120k flip-flops and 90-240 DSP slices
  • Uses the widely-supported and compact SO-DIMM form factor
  • Supports Gigabit Ethernet and analog inputs
  • Available in industrial temperature range

Benefits

  • Simple, low-cost and rugged assembly, in the industry-standard SO-DIMM form factor
  • Simple and low-cost integration due to the on-board Gigabit Ethernet interface
  • Fast boot times and support for execution-in-place (XiP) due to the 4 bit parallel SPI Flash
  • Lowest power consumption due to the high-efficiency DC/DC converters
  • Many IP cores are available from Xilinx, Enclustra and third parties.
 

Features

  • Xilinx Artix-7 28nm FPGA
  • SO-DIMM form factor (67.6 x 30 mm, 200 pins)
  • 108 user I/Os
    • 92 single-ended or differential I/Os
    • 16 single-ended, differential or analog I/Os (8 auxiliary differential analog channels)
  • 1 dedicated differential analog channel
  • 64 MB quad SPI Flash
  • 256 MB DDR3 SDRAM
  • Gigabit Ethernet PHY
  • 3.3 V tolerant inputs
  • Single 3.3V supply voltage
  • Migration from Mars MX1/MX2 FPGA modules possible with some restrictions. Please contact us for information.

Module Architecture

Mars AX3 Module Architecture
Click image to enlarge

Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.

Product Selection Matrix

Product CodeFPGAQuad SPI FlashDDR3L SDRAMEthernet PHYTemp. RangeStatus
MA-AX3-35-1C-D8 XC7A35T-1CSG324C 16MB 256MB 1Gbps 0..+70°C no match
MA-AX3-35-1I-D8 XC7A35T-1CSG324I 16MB 256MB 1Gbps -40..+85°C
MA-AX3-50-1C-D8 XC7A50T-1CSG324C 16MB 256MB 1Gbps 0..+70°C no match
MA-AX3-50-1I-D8 XC7A50T-1CSG324I 16MB 256MB 1Gbps -40..+85°C
MA-AX3-100-1C-D8 XC7A100T-1CSG324C 16MB 256MB 1Gbps 0..+70°C
MA-AX3-100-2I-D8 XC7A100T-2CSG324I 16MB 256MB 1Gbps -40..+85°C
Custom Configurations Click to view custom configuration options
XC7A 35T 1 CSG324 C
  50T 2   E
  75T 2L   I
  100T 3    

16MB


128MB
256MB
512MB


1Gbps
0..+70°C
-40..+85°C

Click on table to enlarge

Key: in-stock In stock limited-quantities Limited quantities available-soon In production contact-us Contact us

Minimum order quantities apply for custom module configurations - please get in touch.

Pricing

Show prices in: EUR USD CHF

Product CodeMinimum Order Quantity1EURUSDCHF
1+30+100+1000+10000+1+30+100+1000+10000+1+30+100+1000+10000+
MA-AX3-35-1C-D815012311711192731421351281068413913212510482
MA-AX3-35-1I-D81136129122101791571491401169115314613811489
MA-AX3-50-1C-D8120159149140105781831721611219017916815811988
MA-AX3-50-1I-D8110177165154115862041901771329920018617413097
MA-AX3-100-1C-D8100204187172139108235215198160124230211194157122
MA-AX3-100-2I-D81260236216174136299272249200157293266244196153

Click on table to enlarge

1: For non-preferred configurations, the minimum order quantity (MOQ) only applies if the modules are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.

Mars Heat Sink

Mars Heatsink (Top)

The Mars heat sink is an optimal solution to cool the Mars AX3 – it's low profile (less than 7 mm tall) and covers the whole module surface. It comes with a gap pad for the FPGA and four screws to attach it to the module PCB. With additional user configured gap pads, it is possible to cool other components on board as well.

To cool the module even further, a mounting slot in the center of the heat sink makes it easy to attach fans of different sizes – see the technical drawing for details. To order the Mars Heat Sink , add it in the order form next to the Mars AX3, for only EUR 9 / USD 10 / CHF 10.

Base Boards

Select one of these base boards to get started with development straight out of the box.

Base BoardDescription
Mars EB1 An ideal platform for a stereo frame grabber and other video applications.
Mars PM3 A powerful platform with a wealth of I/O interfaces: Ethernet, USB 3.0, FMC low pin count and more.

 

Target Applications

  • Data Acquisition
  • High-Speed Communications
  • Digital Signal Processing
  • Image Processing
  • Embedded Computing
  

Related Products

  • Mars PM3 p-ITX Base Board more
  • Display Controller IP Core more


Ordering

  

Support and Further Information


Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.