The Mercury+ SA2 system-on-chip (SoC) module combines Intel's Cyclone V ARM Processor-based SoC FPGA with fast DDR3L SDRAM, quad SPI flash, a Gigabit Ethernet PHY, dual Fast Ethernet PHYs and an RTC and thus forms a high-performance embedded processing solution, combining the flexibility of a CPU system with the raw, real-time parallel processing power of an FPGA.
Highlights
Built around the Intel Cyclone® V ARM® Processor-based SoC FPGA
Offers USB 3.0, USB 2.0, PCIe® x4, Gigabit Ethernet and dual Fast interfaces
Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.
Product Selection Matrix
Product Code
SoC FPGA
DDR3L SDRAM
PCIe
Temp. Range
Status
ME-SA2-D6-7I-D11
5CSTFD6D5F31I7N
2GB
✔
-40..+85°C
Custom Models
Click to view custom models options
TBC
TBC
TBC
TBC
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Key:
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Minimum order quantities apply for custom module configurations. Please contact us.
We provide CNY prices with 13% VAT, please contact our China sales.
1+
30+
100+
1000+
10000+
1+
30+
100+
1000+
10000+
1+
30+
100+
1000+
10000+
我们在中国有分公司，提供人民币含税价，请联系sales.cn@enclustra.com
ME-SA2-D6-7I-D11
✔
513
473
423
349
273
529
488
436
360
282
498
459
410
339
265
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1: For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.
Mercury Heat Sink
Large Heat Dissipation
High performance devices like the Xilinx Zynq Ultrascale+ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.
The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.
The Mercury heatsink is provided as part of a heatsink accessory package including:
Heatsink body
Mounting material
Standard fan
Gap pad set
Design-in Kit – The Fast Way to the Market
The Enclustra Design-in Kits help shorten time-to-market for any Xilinx Zynq UltraScale+ MPSoC based application.
The design-in kits include everything you need to get started, also 2 AI example applications with all sources.
The examples are based on ResNet50 and Xilinx Vitis AI. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself.
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Base Boards
Select one of these base boards to get started with development straight out of the box.
a versatile PCIe® base board equipped with a multitude of I/O interfaces compatible with all Mercury and Mercury+ modules. Especially suited for high-speed communication applications thanks to the QSFP+/SFP+ interfaces.
Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.
For commercial reasons, this file is only available to Enclustra customers - if you're already a customer, simply fill in your name, company and email address below and we'll send you the file as soon as possible (usually within 24 hours).
If you're not currently a customer, we'd appreciate if you could provide a short message about your project requirements, and anything else we can assist you with.
Document Request
After filling out your contact details you will get an Email with a
download link.
If you're not currently a customer, we'd appreciate if you could provide a
short message about your project requirements, and anything else we can
assist you with.
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