Mercury+ SA2

Intel® Cyclone® V SoC Module

Mercury+ SA2 SoC Module Mercury+ SA2 SoC Module (Front)
Mercury+ SA2 SoC Module (Back)

Overview

The Mercury+ SA2 system-on-chip (SoC) module combines Intel's Cyclone V ARM Processor-based SoC FPGA with fast DDR3L SDRAM, quad SPI flash, a Gigabit Ethernet PHY, dual Fast Ethernet PHYs and an RTC and thus forms a high-performance embedded processing solution, combining the flexibility of a CPU system with the raw, real-time parallel processing power of an FPGA.

 

Highlights

  • Built around the Intel Cyclone® V ARM® Processor-based SoC FPGA
  • Offers USB 3.0, USB 2.0, PCIe® x4, Gigabit Ethernet and dual Fast interfaces
  • Available in industrial-grade temperature range
  • Smaller than a credit card
  • Linux BSP and tool chain available
  • Powerful and compact FPGA board
Enclustra Design Services

Benefits

  • A complete and powerful embedded processing system in a compact, space-saving form factor
  • Large, high-bandwidth memory, with up to 2 GByte of DDR3L SDRAM
  • High-bandwidth data transfer: PCIe® x4 interface, and a high number of available LVDS pairs provide high-speed data I/O at low integration cost
  • Lowest power consumption due to the high-efficiency DC/DC converters
  • Support for Linux operating systems
 

Features

  • Intel Cyclone® V ARM® Processor-based SoC FPGA
    • ARM® dual-core Cortex™-A9
      (32 bit, up to 800 MHz)
    • Intel Cyclone V 28nm FPGA fabric
  • Small form factor (74 × 54 mm)
  • 294 user I/Os
    • 18 ARM peripheral I/Os (2 × CAN, SPI, SDIO, 2 × I2C, 2 × UART)
    • 234 FPGA I/Os (single-ended or differential))
      • 202 FPGA I/Os
      • 32 FPGA I/Os shared with USB 3.0
    • 42 MGT signals (clock and data)
  • 9 × 6.144 Gbps MGTs
  • Up to 2 GByte DDR3L SDRAM
  • 64 MB QSPI flash
  • PCIe® Gen1/Gen2 x4
  • Gigabit Ethernet
  • Dual Fast Ethernet
  • USB 3.0 device controller
  • USB 2.0 device controller
  • 2 × CAN, 2 × UART, SPI, 2 × I2C, SDIO/MMC
  • 5 to 15 V supply voltage

Module Architecture

Mercury SA2 Module ArchitectureClick image to enlarge

Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.

Product Selection Matrix

Product CodeSoC FPGADDR3L SDRAMPCIeTemp. RangeStatus
ME-SA2-D6-7I-D11 5CSTFD6D5F31I7N 2GB -40..+85°C
Custom Models Click to view custom models options
TBC
TBC TBC TBC

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Key: in-stock Active limited-quantities Early Access contact-us Contact us

Minimum order quantities apply for custom module configurations. Please contact us.

Pricing

Show prices in: EUR USD CHF CNY

Product CodePreferred model1EURUSDCHFWe provide CNY prices with 13% VAT, please contact our China sales.
1+30+100+1000+10000+1+30+100+1000+10000+1+30+100+1000+10000+ 我们在中国有分公司,提供人民币含税价,请联系sales.cn@enclustra.com
ME-SA2-D6-7I-D11513473423349273529488436360282498459410339265

Click on table to enlarge

1: For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.

Mercury Heat Sink

enclustra mercury heat sink hs3

Large Heat Dissipation

High performance devices like the Xilinx Zynq Ultrascale+ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.

The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.

The Mercury heatsink is provided as part of a heatsink accessory package including:

  • Heatsink body
  • Mounting material
  • Standard fan
  • Gap pad set

Design-in Kit – The Fast Way to the Market

enclustra design-in kit xu5

The Enclustra Design-in Kits help shorten time-to-market for any Xilinx Zynq UltraScale+ MPSoC based application. The design-in kits include everything you need to get started, also 2 AI example applications with all sources.

The examples are based on ResNet50 and Xilinx Vitis AI. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself. more

Base Boards

Select one of these base boards to get started with development straight out of the box.

Base BoardDescription
Mercury+ ST1 A flexible board optimized for video applications and the perfect fit for our Mercury and Mercury+ modules.
Mercury+ PE3 a versatile PCIe® base board equipped with a multitude of I/O interfaces compatible with all Mercury and Mercury+ modules. Especially suited for high-speed communication applications thanks to the QSFP+/SFP+ interfaces.
Mercury+ PE1 A feature-packed board with 3 different variants, compatible with all Mercury and Mercury+ modules.
 

Operating System Support

OS Details Availability

linux

Linux

Available now

Target Applications

  • Embedded Computing
  • Data Acquisition
  • High-Speed Communications
  • Drive/Motion Control
  • Digital Signal Processing
  • Image Processing
  

Related Products

  • Mercury+ ST1 Base Board more
  • Mercury+ PE1 PCIe Base Board more
  • Universal Drive Controller IP Core more


Ordering

 

Support and Further Information


Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.