Enclustra, the Swiss-based leader in FPGA innovation with a strong footprint across Europe, the Americas, and Asia, proudly announces the launch of its new Physical AI Technology Line. This milestone builds on the March 2025 announcement at Embedded World, Nuremberg, of Enclustra’s strategic partnership with SiMa.ai and the joint introduction of the MLSoC™ Modalix System-on-Module (SoM), leveraging SiMa.ai’s 50 TOPS MLSoC device.

With industries worldwide accelerating digital transformation, Enclustra’s new product line addresses the growing demand for multi-modal AI, Physical AI, and Generative AI applications at the embedded edge. The Modalix SoM provides a high-performance, energy-efficient solution that enables organizations in manufacturing, robotics, industrial automation, aerospace, and defense to integrate advanced AI capabilities faster, more reliably, and at scale. Customers can place orders immediately to secure early delivery and be among the first to deploy next-generation AI at the embedded edge.

The joint innovation introduces a powerful, compact solution that showcases the best of both companies’ expertise. Enclustra brings its Edge AI know-how and advanced system design together with SiMa.ai’s leadership in Physical AI — creating a unique combination of technologies that sets a new standard for embedded intelligence. Addressing key challenges of platforms at the edge, the new Enclustra - Modalix MLSoM delivers high performance with low power consumption, enabling efficient AI computing across diverse embedded applications where machines must both think and act.

Our joint product is a 50 TOPS purpose-built SoM for Physical AI, which enables larger LLM workloads at under 10 watts of power consumption. It features a pin-compatible form factor with leading GPU SoMs, simplifying system upgrades and integration. It also provides wide I/O flexibility, industrial-grade thermal management, and real-time performance monitoring — ensuring reliability for the most demanding applications. The technology is supported by SiMa.ai’s ONE Platform software, featuring Palette and Edgematic tools for streamlined AI deployment in familiar development environments such as Python, PyTorch, and OpenCV.

Designed for industries undergoing rapid digital transformation — including manufacturing, robotics, aerospace, defense, and industrial automation — the Physical AI line accelerates innovation in smart robotics, predictive maintenance, AI-enabled controls, and autonomous systems.

“As a pioneer in high-performance embedded solutions, Enclustra is committed to pushing the boundaries of FPGA and SoM innovation,” said Philipp Baechtold, CEO of Enclustra. “With Swiss innovation at our core and a growing presence across global markets, this launch strengthens our ability to deliver Edge AI solutions that empower industries to scale AI adoption efficiently.”

Krishna Rangasayee, CEO of SiMa.ai. Added: “Together with Enclustra, we are removing integration barriers and making it remarkably simple for companies worldwide to upgrade from legacy systems to Modalix’s superior performance.” Engineering samples of the MLSoC Modalix SoM are available now through Enclustra’s exclusive Early Access Program. Organizations worldwide can request participation here:

Learn more and request Early Access

Read more in the official Press Release.

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We're pleased to announce our participation in this year’s FPGA Conference Europe, taking place in Munich this July. As Europe's key event for field-programmable gate array (FPGA) technologies, it brings together the brightest engineers and thought leaders for hands-on insights, proven methodologies, and the latest in embedded design.

This year, we’re putting the spotlight on three highly anticipated technical presentations from our team, each packed with practical strategies and real-world engineering takeaways.

Meet our Experts!

Join the talk with our experts’ technical presentations that reflect our ongoing commitment to practical innovation in FPGA development:

• Doubling RFSoC ADC Rate from 5 Gsps to 10 Gsps
  Speaker: Dr. Harry Commin, Lead FPGA/SoC firmware Engineer at Enclustra
  Level: Expert | Date: July 3 | Time: 11:50
  Discover how to digitally combine three ADCs on AMD RFSoC to double the sampling rate - no special analog circuitry required. Includes practical results from a research project on AMD RFSoC.
• Introduction to the VUnit Verification Framework
  Speaker: Oliver Bründler, Staff Engineer at Enclustra
  Level: Beginner | Date: July 2 | Time: 14:15
  A practical introduction to VUnit, the open-source VHDL verification framework. Learn how it simplifies automation, enhances test coverage, and accelerates development workflows.
• Open Logic: Open-Source FPGA Standard Library
  Speaker: Oliver Bründler
  Level: Beginner | Date: July 2 | Time: 17:20
  Explore the benefits of the Open Logic HDL library and how reusable, vendor-independent modules can streamline your FPGA development workflows. We look forward to seeing you in Munich - let’s talk about your next FPGA project.

We look forward to seeing you in Munich - let’s talk about your next FPGA project.

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Nuremberg, Germany

Enclustra’s Andromeda XRU50 RFSoC module has been awarded Embedded Computing Design’s Best in Show Award in the Wireless Communications category at Embedded World 2025, recognizing its cutting-edge capabilities in RF signal processing. Selected from a record number of entries, this accolade underscores the module’s impact on the future of FPGA-based radiofrequency applications.

Recognition Affirms Dedication to RF Advancement

“The rapid evolution of RFSoC technology is opening doors to groundbreaking advancements across industries, from wireless communication to quantum computing,” said Phillip Bächtold, CEO of Enclustra. “With the Andromeda XRU50 RFSoC, we are equipping engineers with the tools they need to drive the next wave of innovation.”

Next-Level RF Performance in a Compact Form

The Andromeda XRU50 RFSoC integrates AMD’s Zynq™ UltraScale+™ RFSoC, delivering high performance and programmability in a compact, power-efficient package. It supports demanding RF applications, including:

• 5G Wireless Communication – Enabling massive MIMO and adaptive beamforming.
• Phased-Array Radar – Enhancing target tracking and signal accuracy.
• Quantum Computing – Providing precise microwave pulse generation for qubit control.

With eight digital-to-analog and analog-to-digital RF converters, the module allows direct RF signal synthesis without additional analog circuitry, significantly streamlining system development. Future product variants will expand capabilities with up to 16 RF converters.

Designed for Seamless Integration

Measuring just 80 x 64 mm, the Andromeda XRU50 RFSoC provides product developers with easy access to:

• 200+ programmable logic I/Os
• 20 multi-gigabit transceivers
• 32 GB of on-module memory
• Gigabit Ethernet, USB 3.0, PCIe, and DDR4 interfaces

A dedicated RF front-end board further extends functionality, offering 22 RF connectors and integrated RF clock management for enhanced signal processing and streamlined implementation.

Early Access Program Now Available

Developers can now explore the Andromeda XRU50 RFSoC module through an Early Access Program, providing firsthand experience with its advanced features. Engineering samples and comprehensive development tools are also available to accelerate system integration.

Join Us at Embedded World 2025

Attendees can see the award-winning Andromeda XRU50 RFSoC in action at **Hall 3A, Booth 331 form March 11 to 13 in NürnbergMesse GmbH, Messezentrum 1, 90471 Nürnberg, Germany. The Enclustra team will be on-site to demonstrate its capabilities and discuss real-world applications.

For more information, watch the Enclustra Andromeda XRU50 RFSoC video, visit our webpage, or contact us via our request form.

The countdown to Embedded World 2025 has begun, and we’re gearing up for an electrifying showcase of cutting-edge technology. Mark your calendars and visit us at the industry's most anticipated event for embedded systems!

Step Into the Innovation Hub: The Enclustra Product Wall

This year, we’re raising the bar with breakthrough solutions designed for next-generation applications. Immerse yourself in our latest FPGA and SoC modules, each engineered for performance, speed, and reliability.

• Andromeda XRU50 RFSoC – The Ultimate RF Powerhouse
  Pushing the boundaries of RF technology, this AMD Zynq™ UltraScale+™ RFSoC-based module is built for 5G networking, phased-array radar, and satellite communication. Experience its unparalleled capabilities firsthand! See it in action:
  
  Watch the video
• Agilex 5 E-Series (Andromeda IAE50) – Optimized for Vision & AI
  Designed around Altera’s Agilex 5 E-Series SoC, this module is a game-changer for industrial automation, vision systems, and high-performance computing. Discover how it drives efficiency across industries.
• Andromeda Family – Where Speed Meets Precision
  Engineered for ultra-low latency and real-time response, the Andromeda Family is the go-to choice for mission-critical applications in automotive electronics, aerospace, and defense.
• Mercury Family – Master of Communication
  From satellites and sonar to 3D mapping and machine learning, the Mercury Family thrives in extreme conditions, ensuring seamless communication across vast distances.
• Mars XU3 – The Versatile Powerhouse
  A true multi-tasker, Mars XU3 is perfect for embedded computing, high-speed communications, digital signal processing, and motion control.

But that’s not all! We’re also unveiling the latest developments with Pluto XZU20 - a standout from Embedded World 2024, still pushing boundaries for limitless portable applications. Watch the video here.

Finally, come and celebrate our exciting new AI partnership with us!

Guest Demos: Partnering for Innovation in Real-World Applications

At our booth, experience real-world applications with real-life partner demos by:

• Narda
• EASii IC
• Klepsydra
• Draminski Microchip PolarFire®
• Valencia Polytechnic University, Hyper Kamiokande

Our team of experts will be on-site to guide you through the latest advancements, discuss solutions tailored to your needs, and connect you with industry leaders shaping the future of embedded systems.

See the future of embedded technology in action-visit us at Embedded World 2025!

Stay tuned on LinkedIn and X (Twitter) for updates and sneak peeks leading up to the event. We look forward to seeing you in Nuremberg! Have a question?
Contact us here.