Mercury+ MP1

Microchip® PolarFire® SoC MPSoC Module

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Mercury+ MP1 SoC Module Mercury+ MP1 SoC Module (Front)
Mercury+ MP1 SoC Module (Back)

Overview

The Mercury+ MP1 system-on-chip (SoC) module combines Microchip®’s PolarFire® SoC-series device with fast DDR4 ECC SDRAM, eMMC flash, SPI flash, dual Gigabit Ethernet PHY, USB 2.0 PHY and thus forms a complete and powerful embedded processing system.

 

Highlights

  • Built around Microchip’s PolarFire SoC
  • Two independent memory channels for MSS (DDR4 ECC SDRAM) and FPGA fabric (DDR4 SDRAM)
  • Up to 19.2 GByte/sec memory bandwidth
  • Offers up to PCIe® Gen2 x4, USB 2.0 and 2 x Gigabit Ethernet interfaces
  • Available in industrial temperature range
  • Three 168-pin Hirose FX10 connectors with 295 user I/Os
  • Linux BSP and tool chain available
  • Powerful and compact FPGA board

Benefits

  • A complete and powerful embedded processing system in a compact, space-saving form factor
  • Deterministic and coherent platform for demanding real-time applications, based on RISC-V ISA
  • Large, high-bandwidth memory, with up to 4 GByte of DDR4 ECC SDRAM (MSS) and up to 8 GByte of DDR4 RAM (FPGA fabric)
  • High-bandwidth data transfer: PCIe Gen2 x4, USB 2.0, and a high number of available LVDS pairs provide high-speed data I/O at low integration cost
  • Lowest power consumption due to the high-efficiency DC/DC converters and to low-power SoC device
  • Support for Linux operating system
  

Features

  • Microchip PolarFire SoC
    • Four 64-bit RV64GC Quad Application processing cores
    • 64-bit RV64IMAC monitor processor core
    • 28nm non-volatile FPGA fabric
  • Up to 4 GB DDR4 ECC SDRAM (MSS)
  • Up to 8 GB DDR4 SDRAM (FPGA)
  • 64 MB QSPI flash (MSS)
  • 64 MB SPI flash (FPGA fabric)
  • 16 GB eMMC flash
  • Up to 20 × up to 12.7 Gbit/sec MGT
  • PCIe Gen2 ×4 support
  • 2 × Gigabit Ethernet (SGMII interface on MSS side)
  • USB 2.0 OTG
  • Up to 461’000 LUT4-eq
  • 295 user I/Os
    • 9 MSS I/Os
    • Up to 206 GPIOs (up to 3.3 V)
    • Up to 100 MGT signals (clock and data)
  • 5-13.2 V single supply
  • Small form factor (74 × 54 mm)

Module Architecture

Mercury+ MP1 Module ArchitectureClick image to enlarge
1. -E1 variants are assembled with only 1 Gigabit Ethernet PHY.

Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.

Product Selection Matrix

Product Code SoC DDR4 ECC SDRAM (MSS) DDR4 SDRAM (FPGA) ETH
PHYs 		Temp. Range Status
ME-MP1-250-SI-D3EN MPFS250TS-FCG1152I 2GB N/A 2 -40..+85°C
ME-MP1-250-SI-D3EN-E1 MPFS250TS-FCG1152I 2GB N/A 1 -40..+85°C
ME-MP1-460-1SI-D4E MPFS460TS-1FCG1152I 4GB 8GB 2 -40..+85°C
Custom Models Click to view custom models options
TBC
TBC TBC TBC

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Key: in-stock Active limited-quantities Early Access contact-us Contact us

Minimum order quantities apply for custom module configurations. Please contact us.

Pricing

Show prices in: EUR USD CHF CNY

Product CodePreferred model1EURUSDCHFWe provide CNY prices with 13% VAT, please contact our China sales.
1+30+100+1000+10000+1+30+100+1000+10000+1+30+100+1000+10000+ 我们在中国有分公司，提供人民币含税价，请联系kiddy.xu@enclustra.com
ME-MP1-250-SI-D3EN886807727548449944860774584478860783705532435
ME-MP1-250-SI-D3EN-E1 ✔ 886807727548449933850764575471850774696524429
ME-MP1-460-1SI-D4E ✔ 1296110298176161413801174104581165412571069952739596

Click on table to enlarge

1: For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.

Mercury Heat Sink
enclustra mercury heat sink hs3

The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.

The Mercury heatsink is provided as part of a heatsink accessory package including:

  • Heatsink body
  • Mounting material
  • Standard fan
  • Gap pad set

Base Boards

Select one of these base boards to get started with development straight out of the box.

Base BoardDescription
Mercury+ ST1 A flexible board optimized for video applications and the perfect fit for our Mercury and Mercury+ modules.
Mercury+ PE3 a versatile PCIe® base board equipped with a multitude of I/O interfaces compatible with all Mercury and Mercury+ modules. Especially suited for high-speed communication applications thanks to the QSFP+/SFP+ interfaces.
Mercury+ PE1 A feature-packed board with 3 different variants, compatible with all Mercury and Mercury+ modules.

Warning: Due to the pinout assignments (pin types and I/O voltage levels) on module connectors B and C, affecting the FMC interfaces, the compatibility of the Mercury+ XU9 SoC module to the Mercury+ PE1 base board is limited. It is recommended to check the FMC card pinout in detail with the Enclustra Mercury Master Pinout and with the module and base board schematics.

 

Operating System Support

OS Details Yocto BSP

linux

Linux
  • BSP support for:
    • DDR4 SDRAM
    • eMMC flash / SC Card
    • Quad SPI flash
    • USB host
    • Gigabit Ethernet
    • I2C
    • SPI TPM
  • Yocto BSP layer including documentation
  • Supported boot modes: SD card or eMMC
  • U-boot as second stage bootloade
Available now

Target Applications

  • Embedded Computing
  • Data Acquisition
  • High-Speed Communications
  • Drive/Motion Control
  • Digital Signal Processing
  • Image Processing
   

Related Products

  • Mercury+ ST1 Base Board more
  • Mercury+ PE1 Base Board more


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Support and Further Information
Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.