Mercury+ KX2

Xilinx® Kintex®-7 FPGA Module

Mercury+ KX2 FPGA Module Mercury+ KX2 FPGA Module (front)
Mercury+ KX2 FPGA Module (back)


The Mercury+ KX2 module offers the best performance-to-price-ratio Xilinx Kintex-7 28nm FPGAs in conjunction with the standard interfaces like USB 2.0, PCIe Gen2 and Gigabit Ethernet.

With powerful FPGA and standard interfaces, many LVDS-capable I/Os, large DDR3 SDRAM and many high-speed DSP slices, the KX2 is as well-suited for high-end digital signal processing, communications and networking as it is for high-speed I/O applications.

The Mercury+ KX2 FPGA board reduces development effort, redesign risk and improves time-to-market.



  • Features the latest best performance-per-price Xilinx Kintex-7 28nm FPGA family
  • Provides dual Gigabit Ethernet PHYs for high-bandwidth/low-latency networking
  • Provides PCIe Gen2 x8 endpoint for high-speed data transfer
  • Up to 12.8 GByte/sec memory bandwidth
  • Available in industrial-grade temperature range
  • Smaller than a credit card
  • Supply voltage 5 to 15V
  • Powerful and compact FPGA board


  • Vast amount of parallel processing power for DSP applications (up to 1540 DSP Slices at 650 MHz = 2 TMAC/s)
  • High-bandwidth data I/O due to the large number of available LVDS pairs
  • Simple and low-cost integration due to standard interfaces (USB 2.0, PCIe Gen2, Gigabit Ethernet), single supply voltage and 1.8V / 2.5V / 3.3V power outputs
  • Big and high-bandwidth data memory due to DDR3 SDRAM
  • Many IP cores are available from Xilinx, Enclustra and third parties.
  • Simplified carrier board design (typically 4 layers)


  • Xilinx Kintex-7 28nm FPGA in the 676-pin package
  • Small form factor (74 x 54 mm, triple 168-pin Hirose FX10 connectors)
  • 256 User I/Os
    • 194 single-ended or differential I/Os
    • 22 single-ended, differential or analog I/Os (11 auxiliary differential analog channels)
    • 12 MGT signals (clock and data)
  • 1 dedicated differential analog channel
  • 64 MByte Quad SPI Flash
  • Up to 2048 MByte DDR3 SDRAM
  • 8 × 6.6/10.3125 Gbit/sec MGT with integrated PCIe Gen2 x8 interface
  • Dual Gigabit Ethernet PHYs
  • High-power 20A core power supply

Module Architecture

Mars CA4 Module ArchitectureClick image to enlarge

Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.

Product Selection Matrix

Product CodeFPGA  SPI FlashDDR3 SDRAMGigabit EthernetTemp. RangeStatus
ME-KX2-160-2I-D11-P XC7K160T-2FFG676I 64MB 2GB Dual -40..+85°C
ME-KX2-410-2I-D11-P XC7K410T-2FFG676I 64MB 2GB Dual -40..+85°C else
Custom Models Click to view custom models options
XC7K 160- 1 FBG676 C
  325- 2 FFG676 I
  410- 2L    




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Key: in-stock Active limited-quantities Early Access contact-us Contact us

Minimum order quantities apply for custom module configurations. Please contact us.


Show prices in: EUR USD CHF CNY

Product CodePreferred model1EURUSDCHFWe provide CNY prices with 13% VAT, please contact our China sales.
1+30+100+1000+10000+1+30+100+1000+10000+1+30+100+1000+10000+ 我们在中国有分公司,提供人民币含税价,请联系

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1: For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.

Mercury Heat Sink

enclustra mercury heat sink hs3

Large Heat Dissipation

High performance devices like the Xilinx Zynq Ultrascale+ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.

The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.

The Mercury heatsink is provided as part of a heatsink accessory package including:

  • Heatsink body
  • Mounting material
  • Standard fan
  • Gap pad set

Base Boards

Select one of these base boards to get started with development straight out of the box.

Base BoardDescription
Mercury+ ST1 A flexible board optimized for video applications and the perfect fit for our Mercury and Mercury+ modules.
Mercury+ PE3 a versatile PCIe® base board equipped with a multitude of I/O interfaces compatible with all Mercury and Mercury+ modules. Especially suited for high-speed communication applications thanks to the QSFP+/SFP+ interfaces.
Mercury+ PE1 A feature-packed board with 3 different variants, compatible with all Mercury and Mercury+ modules.

Target Applications

  • Digital Signal Processing
  • Video Processing
  • Software-defined Radio
  • Communications

Related Products

  • Mercury+ PE1 PCIe Base Board more
  • FPGA Manager Ethernet more



Support and Further Information

Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.