Mars XU3

Xilinx® Zynq® UltraScale+ MPSoC Module

Mars XU3 SoC Module Mars XU3 SoC Module (Front)
Mars XU3 SoC Module (Back)


The Mars XU3 system-on-chip (SoC) module combines Xilinx's Zynq UltraScale+ MPSoC device with fast DDR4 SDRAM, eMMC flash, quad SPI flash and a Gigabit Ethernet PHY, USB 3.0 and thus forms a complete and powerful embedded processing system.

The SO-DIMM form factor allows space-saving hardware designs as well as quick and simple integration of the module into the target application.

The Mars XU3 SoC module reduces development effort, redesign risk and improves time-to-market for your embedded system.



  • Built around Xilinx's Zynq UltraScale+ MPSoC
  • Combines the flexibility of a CPU system with the parallel processing power and real-time capabilities of an FPGA system
  • Fast DDR4 SDRAM
  • Supports analog differential inputs
  • Available in industrial temperature range
  • Supports USB 3.0, CAN, Gigabit Ethernet and PCIe® Gen2 x4
  • Linux BSP and tool chain available
Enclustra Design Services


  • A complete and powerful embedded processing system in the industry-standard SO-DIMM form factor
  • Simple, low cost and yet rugged assembly
  • Simple and low-cost integration due to the on-board standard interfaces (USB, Ethernet, CAN)
  • High-bandwidth program and data memory due to the high-performance hard-macro memory controller
  • Lowest power consumption due to the high-efficiency DC/DC converters


  • Xilinx® Zynq Ultrascale+™ MPSoC
    • ARM® quad-/dual-core Cortex™-A53
      (64 bit, up to 1333 MHz)
    • ARM dual-core Cortex™-R5
      (32 bit, up to 533 MHz)
    • 16nm FinFET+ FPGA fabric
  • Mali-400MP2 GPU
    (only EG models)
  • Up to 4 GB DDR4 SDRAM
  • 64 MB QSPI flash
  • 16 GB eMMC flash
  • Gigabit Ethernet
  • USB 3.0
  • USB 2.0 OTG PHY
  • PCIe® Gen2 ×4
  • 4 × 5 Gbit/sec MGT
  • Up to 154,000 LUT4-eq
  • 108 user I/Os
    • 12 ARM peripherals
    • 76 FPGA I/Os
    • 20 MGT signals (clock and data)
  • 67.6 × 30 mm SO-DIMM

Module Architecture

Mars XU3 Module ArchitectureClick image to enlarge

Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.

Product Selection Matrix

Product CodeMPSoCDDR4 SDRAMTemp. RangeStatus
MA-XU3-2CG-1E-D10 XCZU2CG-1SBVA484E 1GB 0..+85°C
MA-XU3-2EG-1I-D10 XCZU2EG-1SBVA484I 1GB -40..+85°C else
MA-XU3-3EG-2I-D11 XCZU3EG-2SBVA484I 2GB -40..+85°C
Custom Models Click to view custom models options

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Key: in-stock Active limited-quantities Early Access contact-us Contact us

Minimum order quantities apply for custom module configurations. Please contact us.


Show prices in: EUR USD CHF CNY

Product CodePreferred model1EURUSDCHFWe provide CNY prices with 13% VAT, please contact our China sales.
1+30+100+1000+10000+1+30+100+1000+10000+1+30+100+1000+10000+ 我们在中国有分公司,提供人民币含税价,请联系

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1: For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.

Design-in Kit – The Fast Way to the Market

enclustra design-in kit xu5

The Enclustra Design-in Kits help shorten time-to-market for any Xilinx Zynq UltraScale+ MPSoC based application. The design-in kits include everything you need to get started, also 2 AI example applications with all sources.

The examples are based on ResNet50 and Xilinx Vitis AI. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself. more

Mars Heat Sink

Mars Heatsink (Top)

The Mars heat sink is an optimal solution to cool the Mars XU3 – it's low profile (less than 7 mm tall) and covers the whole module surface. It comes with a gap pad for the FPGA and four screws to attach it to the module PCB. With additional user configured gap pads, it is possible to cool other components on board as well.

Base Boards

Select one of these base boards to get started with development straight out of the box.

Base BoardDescription
Mars ST3 An ideal platform for display applications.
Mars EB1 An ideal platform for a stereo frame grabber and other video applications.


Operating System Support

OS Details EBE BSP Petalinux BSP



Available now Available now

Target Applications

  • Embedded Computing
  • Data Acquisition
  • High-Speed Communications
  • Drive/Motion Control
  • Digital Signal Processing
  • Image Processing

Related Products

  • Mars ST3 Base Board more
  • Mars EB1 Base Board more
  • Universal Drive Controller IP Core more
  • Advanced Velocity Estimator IP Core more



Support and Further Information

Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.