Mars XU3

AMD Zynq™ UltraScale+™ MPSoC Module

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Mars XU3 SoC Module Mars XU3 SoC Module (Front)
Mars XU3 SoC Module (Back)

Overview

The Mars XU3 System-on-Chip (SoC) module combines AMD Zynq™ UltraScale+™ MPSoC device with fast DDR4 SDRAM, eMMC flash, quad SPI flash and a Gigabit Ethernet PHY, USB 3.0 and thus forms a complete and powerful embedded processing system.

The SO-DIMM form factor allows space-saving hardware designs as well as quick and simple integration of the module into the target application.

The Mars XU3 SoC module reduces development effort, redesign risk and improves time-to-market for your embedded system.

  

Highlights

  • Built around AMD Zynq™ UltraScale+™ MPSoC
  • Combines the flexibility of a CPU system with the parallel processing power and real-time capabilities of an FPGA system
  • Fast DDR4 SDRAM
  • Supports analog differential inputs
  • Available in industrial temperature range
  • Supports USB 3.0, CAN, Gigabit Ethernet and PCIe® Gen2 x4
  • Linux BSP and tool chain available
Enclustra Design Services

Benefits

  • A complete and powerful embedded processing system in the industry-standard SO-DIMM form factor
  • Simple, low cost and yet rugged assembly
  • Simple and low-cost integration due to the onboard standard interfaces (USB, Ethernet, CAN)
  • High-bandwidth program and data memory due to the high-performance hard-macro memory controller
  • Lowest power consumption due to the high-efficiency DC-DC converters
  

Features

  • AMD Zynq™ Ultrascale+™ MPSoC
    • ARM® quad-/dual-core Cortex™-A53
      (64 bit, up to 1333 MHz)
    • ARM dual-core Cortex™-R5
      (32 bit, up to 533 MHz)
    • 16nm FinFET+ FPGA fabric
  • Mali-400MP2 GPU
    (only EG models)
  • Up to 4 GB DDR4 SDRAM
  • 64 MB QSPI flash
  • 16 GB eMMC flash
  • Gigabit Ethernet
  • USB 3.0
  • USB 2.0 OTG PHY
  • PCIe® Gen2 ×4
  • 4 × 5 Gbit/s MGT
  • Up to 154,000 LUT4-eq
  • 108 user I/Os
    • 12 ARM peripherals
    • 76 FPGA I/Os
    • 20 MGT signals (clock and data)
  • 67.6 × 30 mm SO-DIMM

Module Architecture

Mars XU3 Module ArchitectureClick image to enlarge

Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.

Product Selection Matrix

Product CodeMPSoCDDR4 SDRAMTemp. RangeStatus
MA-XU3-2CG-1E-D10 XCZU2CG-1SBVA484E 1 GB 0..+85°C
MA-XU3-3EG-2I-D11 XCZU3EG-2SBVA484I 2 GB -40..+85°C
Custom Models Click to view custom models options
TBC
TBC TBC

Click on table to enlarge

Key: in-stock Active limited-quantities Early Access contact-us Contact us

Minimum order quantities apply for custom module configurations. Please contact us.

Pricing

Mars Heat Sink
Mars Heatsink (Top)

The Mars heat sink is an optimal solution to cool the Mars XU3 – it's low profile (less than 7 mm tall) and covers the whole module surface. It comes with a thermal gap pad for the FPGA and four screws to attach it to the module PCB. With additional user configured thermal gap pads, it is possible to cool other components on board as well.

Design-in Kit – The Fast Way to the Market
enclustra design-in kit xu3

The Enclustra Design-in Kits help shorten time-to-market for any AMD Zynq™ UltraScale+™ MPSoC based application. The design-in kits include everything you need to get started, also 2 AI example applications with all sources.

The examples are based on ResNet50 and AMD Vitis™ Software Platform. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself. more>

Base Boards

Select one of these base boards to get started with development straight out of the box.

Base BoardDescription
Mars ST3 An ideal platform for display applications.
Mars EB1 An ideal platform for a stereo frame grabber and other video applications.

 

Operating System Support

OS Details Linux BSP

linux

Linux
  • BSP support for:
    • DDR4 SDRAM
    • eMMC flash
    • Quad SPI flash
    • USB host
    • Gigabit Ethernet
    • I2C
    • SD Card
  • U-Boot bootloader
  • Documentation
 Available now

Target Applications

  • Embedded Computing
  • Data Acquisition
  • High-Speed Communications
  • Drive/Motion Control
  • Digital Signal Processing
  • Image Processing
   

Related Products

  • Mars ST3 Base Board more
  • Mars EB1 Base Board more
  • Universal Drive Controller IP Core more
  • Advanced Velocity Estimator IP Core more


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Support and Further Information
Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.