The Mercury XU5 system-on-chip (SoC) module combines Xilinx's Zynq UltraScale+™ MPSoC-series device with fast DDR4 ECC SDRAM, eMMC flash, quad SPI flash, dual Gigabit Ethernet PHY, dual USB 3.0 and thus forms a complete and powerful embedded processing system.
Highlights
Built around Xilinx's Zynq Ultrascale+™ MPSoC
Two independent memory channels for PS (DDR4 ECC SDRAM) and PL (DDR4 SDRAM)
Up to 24 GByte/sec memory bandwidth
Offers PCIe® Gen3 x4, PCIe Gen2 x4, 2x USB 3.0 and 2x Gigabit Ethernet interfaces
Available in industrial temperature range
Two 168-pin Hirose FX10 connectors with 178 user I/Os
Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.
Product Selection Matrix
Product Code
MPSoC
DDR4 ECC SDRAM (PS)
DDR4 SDRAM (PL)
Temp. Range
Status
ME-XU5-2CG-1E-D10H1
XCZU2CG-1SFVC784E
1GB (no ECC)
512MB
0..+85°C
ME-XU5-2EG-1I-D11E
XCZU2EG-1SFVC784I
2GB
512MB
-40..+85°C
ME-XU5-3EG-2I-D11E
XCZU3EG-2SFVC784I
2GB
512MB
-40..+85°C
ME-XU5-4CG-1E-D11E-G12
XCZU4CG-1SFVC784E
2GB
512MB
0..+85°C
ME-XU5-4EV-1I-D11E
XCZU4EV-1SFVC784I
2GB
512MB
-40..+85°C
ME-XU5-4EV-1I-D11E-G12
XCZU4EV-1SFVC784I
2GB
512MB
-40..+85°C
ME-XU5-5EV-1E-D11E
XCZU5EV-1SFVC784E
2GB
512MB
0..+85°C
ME-XU5-5EV-2I-D12E
XCZU5EV-2SFVC784I
4GB
1GB
-40..+85°C
ME-XU5-5EV-2I-D12E-G12
XCZU5EV-2SFVC784I
4GB
1GB
-40..+85°C
ME-XU5-5EV-3E-D13E
XCZU5EV-3SFVC784E
8GB
2GB
0..+85°C
Custom Configurations
Click to view custom configuration options
TBC
TBC
TBC
Click on table to enlarge
1: This variant supports only half of the DDR4 bandwidth on the PS side (32-bit interface instead of 64-bit).
2: G1 assembly variants offered for migration purposes or for cases where the end application does not require GTR transceivers, but
instead more regular I/Os. It can be used when porting an existing design from Mercury ZX1 or ZX5 to Mercury XU5 SoC module.
Please refer to the user manual for details on assembly options and migration guidelines. This variant was referred to as “X1” variant in previous user manual versions.
Key:
Mass production
Sampling
Contact us
Minimum order quantities apply for custom module configurations. Please contact us.
We provide CNY prices with 13% VAT, please contact our China sales.
1+
30+
100+
1000+
10000+
1+
30+
100+
1000+
10000+
1+
30+
100+
1000+
10000+
我们在中国有分公司，提供人民币含税价，请联系kiddy.xu@enclustra.com
ME-XU5-2CG-1E-D10H
✔
301
265
235
211
176
356
313
277
249
208
331
291
258
232
194
ME-XU5-2EG-1I-D11E
✔
354
332
310
271
223
418
392
366
320
263
389
365
341
298
245
ME-XU5-3EG-2I-D11E
✔
529
495
464
411
340
625
585
548
485
402
582
544
510
451
374
ME-XU5-4CG-1E-D11E-G1
474
410
359
327
262
560
484
424
386
309
521
450
395
359
288
ME-XU5-4EV-1I-D11E
✔
662
561
484
443
363
782
662
572
523
429
728
616
532
487
399
ME-XU5-4EV-1I-D11E-G1
✔
662
561
484
443
363
782
662
572
523
429
728
616
532
487
399
ME-XU5-5EV-1E-D11E
750
635
549
503
408
886
750
648
594
482
825
698
603
553
449
ME-XU5-5EV-2I-D12E
✔
927
785
679
625
514
1095
927
802
738
607
1019
863
746
687
565
ME-XU5-5EV-2I-D12E-G1
927
785
679
625
514
1095
927
802
738
607
1019
863
746
687
565
ME-XU5-5EV-3E-D13E
1066
981
906
795
673
1259
1158
1070
939
795
1172
1078
996
874
740
Click on table to enlarge
1: For non-preferred configurations, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.
Mercury Heat Sink
Large Heat Dissipation
High performance devices like the Xilinx Zynq Ultrascale+ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.
The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.
The Mercury heatsink is provided as part of a heatsink accessory package including:
Heatsink body
Mounting material
Standard fan
Gap pad set
Design-in Kit – The Fast Way to the Market
The Enclustra Design-in Kits help shorten time-to-market for any Xilinx Zynq UltraScale+ MPSoC based application.
The design-in kits include everything you need to get started, also 2 AI example applications with all sources.
The examples are based on ResNet50 and Xilinx Vitis AI. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself.
more
Base Boards
Select one of these base boards to get started with development straight out of the box.
Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.
For commercial reasons, this file is only available to Enclustra customers - if you're already a customer, simply fill in your name, company and email address below and we'll send you the file as soon as possible (usually within 24 hours).
If you're not currently a customer, we'd appreciate if you could provide a short message about your project requirements, and anything else we can assist you with.
Document Request
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If you're not currently a customer, we'd appreciate if you could provide a short message about your project requirements, and anything else we can assist you with.
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Mass production
Sampling
Contact us
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