The Mercury XU5 system-on-chip (SoC) module combines Xilinx's Zynq UltraScale+™ MPSoC-series device with fast DDR4 ECC SDRAM, eMMC flash, quad SPI flash, dual Gigabit Ethernet PHY, dual USB 3.0 and thus forms a complete and powerful embedded processing system.
Highlights
Built around Xilinx's Zynq Ultrascale+™ MPSoC
Two independent memory channels for PS (DDR4 ECC SDRAM) and PL (DDR4 SDRAM)
Up to 24 GByte/sec memory bandwidth
Offers PCIe® Gen3 x4, PCIe Gen2 x4, 2x USB 3.0 and 2x Gigabit Ethernet interfaces
Available in industrial temperature range
Two 168-pin Hirose FX10 connectors with 178 user I/Os
Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.
Product Selection Matrix
Product Code
MPSoC
DDR4 ECC SDRAM (PS)
DDR4 SDRAM (PL)
Temp. Range
Status
ME-XU5-2CG-1E-D10H1
XCZU2CG-1SFVC784E
1GB (no ECC)
512MB
0..+85°C
ME-XU5-2EG-1I-D11E
XCZU2EG-1SFVC784I
2GB
512MB
-40..+85°C
ME-XU5-3EG-2I-D11E
XCZU3EG-2SFVC784I
2GB
512MB
-40..+85°C
ME-XU5-4CG-1E-D11E-G12
XCZU4CG-1SFVC784E
2GB
512MB
0..+85°C
ME-XU5-4EV-1I-D11E
XCZU4EV-1SFVC784I
2GB
512MB
-40..+85°C
ME-XU5-4EV-1I-D11E-G12
XCZU4EV-1SFVC784I
2GB
512MB
-40..+85°C
ME-XU5-5EV-1E-D11E
XCZU5EV-1SFVC784E
2GB
512MB
0..+85°C
ME-XU5-5EV-2I-D12E
XCZU5EV-2SFVC784I
4GB
1GB
-40..+85°C
ME-XU5-5EV-2I-D12E-G12
XCZU5EV-2SFVC784I
4GB
1GB
-40..+85°C
ME-XU5-5EV-3E-D13E
XCZU5EV-3SFVC784E
8GB
2GB
0..+85°C
Custom Models
Click to view custom models options
TBC
TBC
TBC
Click on table to enlarge
1: This model supports only half of the DDR4 bandwidth on the PS side (32-bit interface instead of 64-bit).
2: G1 model offered for migration purposes or for cases where the end application does not require GTR transceivers, but
instead more regular I/Os. It can be used when porting an existing design from Mercury ZX1 or ZX5 to Mercury XU5 SoC module.
Please refer to the user manual for details on assembly options and migration guidelines. This model was referred to as “X1” model in previous user manual versions.
Key:
Active
Early Access
Contact us
Minimum order quantities apply for custom module configurations. Please contact us.
We provide CNY prices with 13% VAT, please contact our China sales.
1+
30+
100+
1000+
10000+
1+
30+
100+
1000+
10000+
1+
30+
100+
1000+
10000+
我们在中国有分公司，提供人民币含税价，请联系kiddy.xu@enclustra.com
ME-XU5-2CG-1E-D10H
✔
380
334
295
267
226
399
351
310
281
237
391
344
304
275
232
ME-XU5-2EG-1I-D11E
✔
446
418
391
344
283
469
439
411
361
297
460
430
403
354
291
ME-XU5-3EG-2I-D11E
✔
683
640
599
532
442
717
672
629
559
464
703
659
616
548
455
ME-XU5-4CG-1E-D11E-G1
615
531
465
426
343
646
558
489
447
360
633
547
479
438
353
ME-XU5-4EV-1I-D11E
✔
857
725
626
575
472
900
762
658
604
496
882
747
645
592
486
ME-XU5-4EV-1I-D11E-G1
✔
857
725
626
575
472
900
762
658
604
496
882
747
645
592
486
ME-XU5-5EV-1E-D11E
985
835
722
663
540
1035
877
758
697
567
1014
860
743
683
556
ME-XU5-5EV-2I-D12E
✔
1206
1020
883
815
671
1267
1072
928
856
705
1242
1051
910
839
691
ME-XU5-5EV-2I-D12E-G1
1206
1020
883
815
671
1267
1072
928
856
705
1242
1051
910
839
691
ME-XU5-5EV-3E-D13E
1356
1248
1153
1015
858
1425
1311
1211
1066
901
1397
1285
1187
1045
883
Click on table to enlarge
1: For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.
Mercury Heat Sink
Large Heat Dissipation
High performance devices like the Xilinx Zynq Ultrascale+ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.
The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.
The Mercury heatsink is provided as part of a heatsink accessory package including:
Heatsink body
Mounting material
Standard fan
Gap pad set
Design-in Kit – The Fast Way to the Market
The Enclustra Design-in Kits help shorten time-to-market for any Xilinx Zynq UltraScale+ MPSoC based application.
The design-in kits include everything you need to get started, also 2 AI example applications with all sources.
The examples are based on ResNet50 and Xilinx Vitis AI. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself.
more
Base Boards
Select one of these base boards to get started with development straight out of the box.
Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.
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