Overview

The Andromeda IAE50 system-on-chip (SoC) module combines the power optimized Intel Agilex 5 E-Series devices with fast low-power DDR5 memory, eMMC and QSPI flash, dual Gigabit Ethernet PHY, USB 3.1 and thus forms a complete and powerful embedded processing system. The module is suitable for a wide range of applications, from vision (thanks to its integrated MIPI and video IP support), to test and measurement system (for real time processing of sensor data and applications requiring low latency and high bandwidth), security and communication systems.

Highlights

• Built around Intel Agilex 5 E-Series SoC
• Three independent memory channels out of which one equipped with DDR4 ECC SDRAM and two with LPDDR5 SDRAM
• 14.93GByte/s memory bandwidth
• Offers up to USB3.1 and 2 x Gigabit Ethernet interfaces (HPS + FPGA)
• Up to 4 ADM6-Samtec connectors with a total of up to 278 user I/Os
• Linux BSP and tool chain available
• Powerful, low power and compact FPGA board
• Features Enclustra Platform Controller for easy module configuration and bring-up

Benefits

• A complete and powerful embedded processing system in a compact, space-saving form factor
• Large, low power and high-bandwidth memory, with up to 4GB DDR4 ECC SDRAM and up to 8GB LPDDR5 SDRAM
• High bandwidth data transfer: PCIe Gen4x4, USB 3.1 at low integration cost
• High number of transceivers available for various communication protocols
• Support for Linux operating system.

Features

• Intel Agilex 5 E-Series SoC FPGA
  • 85-656 k Logic Elements
  • 1.7 – 26 TOPS
  • ARM dual-core Cortex A55 @1.5GHz
  • ARM dual-core Cortex A76 @ 1.8GHz
• Up to 4GB DDR4-2667 x40 (with ECC)
• Up to 2x 8 GB LPDDR5-3733 x32 memory
• 16 GB eMMC flash (HPS)
• 64 MB QSPI flash (HPS)
• 2 x Gigabit Ethernet PHY (HPS + FPGA)
• USB 2.0 PHY (USB 3.1 with GTS)
• 270 user I/Os:
  • 92 HSIO (1-1.3V)
  • 124 HVIO (1.8-3.3V)
  • 24 HVIO (1.8V)
  • 18 HVIO-LS
  • 12 HPS (1.8V)
• 12V power input
• 25A core power supply
• Small form factor (Andromeda M 68 x 52 mm)

Module Architecture

Click image to enlarge

Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.

Product Selection Matrix

Model Name	FPGA	MGT	Memory	Temp. Range	Status
AM-IAE50-065A-I2V-D4E	A5ED065AB32AI2V	24 GTS @ 28.1 Gbps	Ch0: 2 GB x40 ECC DDR4-2667 | Ch1/2: 2 GB x32 LPDDR5-3733	-40..+85°C
AM-IAE50-065B-I4S-D4E	A5ED065BB32AI4S	24 GTS @ 17.1 Gbps	Ch0: 2 GB x40 ECC DDR4-2400 | Ch1/2: 2 GB x32 LPDDR5-2400	-40..+85°C
AM-IAE50-028A-I3V-D3E	A5ED028AB32AI3V	12 GTS @ 28.1 Gbps	Ch0: 2 GB x40 ECC DDR4-2400 | Ch1/2: N/A	-40..+85°C
AM-IAE50-028B-I4V-D3E	A5ED028BB32AI4S	24 GTS @ 17.1 Gbps	Ch0: 2 GB x40 ECC DDR4-2400 | Ch1/2: N/A	-40..+85°C

Click on table to enlarge

Key: Active Early Access Contact us

Minimum order quantities apply for custom module configurations. Please contact us.

Pricing

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Operating System Support

Target Applications

• Vision
• Test and measurement
• Military and aerospace
• Industrial automation
• Automotive

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