The Mercury+ XU8 system-on-chip (SoC) module combines AMD Zynq™ UltraScale+™ MPSoC-series
device with fast DDR4 ECC SDRAM, eMMC flash, quad SPI flash, dual Gigabit Ethernet PHY, dual USB 3.0
and thus forms a complete and powerful embedded processing system.
Highlights
Built around AMD Zynq™ Ultrascale+™ MPSoC
Two independent memory channels for PS (DDR4 ECC SDRAM) and PL (DDR4 SDRAM)
Up to 28.8 GByte/sec memory bandwidth
Offers PCIe® Gen3 x16, PCIe Gen2 x4, 2x USB 3.0 and 2x Gigabit Ethernet interfaces
Available in industrial temperature range
Three 168-pin Hirose FX10 connectors with 236 user I/Os
A complete and powerful embedded processing system in a compact, space-saving form factor
Large, high-bandwidth memory, with up to 8 GByte of DDR4 ECC SDRAM (PS) and up to 4 GByte of
DDR4 RAM (PL)
High-bandwidth data transfer: PCIe® Gen3 x16, PCIe Gen2 x4, USB 3.0, and a high number of
available LVDS pairs provide high-speed data I/O at low integration cost
Lowest power consumption due to the high-efficiency DC/DC converters
Support for Linux embedded operating system
Features
AMD Zynq™ Ultrascale+™ MPSoC
ARM® quad-core Cortex™-A53 (CG models: dual-core)
ARM dual-core Cortex™-R5
Mali-400MP2 GPU (only for EV models)
H.264 / H.265 Video Codec (only for EV models)
16nm FinFET+ FPGA fabric
Up to 8 GB DDR4 ECC SDRAM (PS)
Up to 4 GB DDR4 SDRAM (PL)
64 MB QSPI flash
16 GB eMMC flash
PCIe® Gen3 ×16 and PCIe Gen2 ×4
20 × 6/12.5/15 Gbit/sec MGT
2 × Gigabit Ethernet
2 × USB 3.0
2 × USB 2.0 (host & host/device)
Up to 504,000 LUT4-eq
236 user I/Os
14 ARM peripherals
122 FPGA I/Os
100 MGT signals (clock and data)
5 to 15 V single supply
Small form factor (74 × 54 mm)
Coating and Burn-In for Enhanced Realibility
Coating and burn-in enhances the reliability and longevity of Enclustra SOMs. The protective coating shields the SOM from environmental stressors like dust, moisture, and chemicals, ensuring optimal performance in harsh conditions. Additionally, the rigorous burn-in process identifies and mitigates potential early-life failures by subjecting each unit to extended periods of thermal stress. These services guarantee superior durability and consistent functionality for critical applications. Please contact us for more information.
Module Architecture
Click image to enlarge
Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.
We provide CNY prices with 13% VAT, please contact our China sales.
1+
30+
100+
1000+
10000+
1+
30+
100+
1000+
10000+
1+
30+
100+
1000+
10000+
我们在中国有分公司，提供人民币含税价，请联系sales.cn@enclustra.com
ME-XU8-4CG-1E-D11E
✔
928
847
-
-
-
958
873
-
-
-
900
821
-
-
-
ME-XU8-5EV-1I-D12E
1574
1436
-
-
-
1623
1481
-
-
-
1526
1393
-
-
-
ME-XU8-7EV-1E-D11E
1724
1563
-
-
-
1778
1612
-
-
-
1673
1516
-
-
-
ME-XU8-7EV-2I-D12E
✔
2182
1980
-
-
-
2251
2042
-
-
-
2117
1921
-
-
-
Click on table to enlarge
1: For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.
High performance devices like the AMD Zynq™ Ultrascale+™ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.
The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.
The Mercury heat sink is provided as part of a heat sink kit including:
Heat sink body
Mounting material
Standard fan
Gap pad set
Base Boards
Select one of these base boards to get started with development straight out of the box.
a versatile PCIe® base board equipped with a multitude of I/O interfaces compatible with all Mercury and Mercury+ modules. Especially suited for high-speed communication applications thanks to the QSFP+/SFP+ interfaces.
A feature-packed board with 3 different variants, compatible with all Mercury and Mercury+ modules.
Warning: Due to the pinout assignments (pin types and I/O voltage levels) on module connectors B and
C,
affecting the FMC interfaces, the compatibility of the Mercury+ XU8 SoC module to the Mercury+ PE1
base board is limited. It is recommended to check the FMC card pinout in detail with the Enclustra
Mercury Master Pinout and with the module and base board schematics.
Information contained on this web page is subject to change without notice. Actual product may
differ in appearance from images shown on this web page.
For commercial reasons, this file is only available to Enclustra customers - if you're already a customer, simply fill in your name, company and email address below and we'll send you the file as soon as possible (usually within 24 hours).
If you're not currently a customer, we'd appreciate if you could provide a short message about your project requirements, and anything else we can assist you with.
Document Request
After filling out your contact details you will get an Email with a
download link.
If you're not currently a customer, we'd appreciate if you could provide a
short message about your project requirements, and anything else we can
assist you with.
Need help with your FPGA/SoC design?
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Early Access
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