The Mercury+ AA1 system-on-chip (SoC) module combines Intel's Arria 10 ARM Processor-based SoC FPGA with fast DDR4 ECC SDRAM, eMMC flash, quad SPI flash, Gigabit Ethernet PHY and an RTC and thus forms a high-performance embedded processing solution, combining the flexibility of a CPU system with the raw, real-time parallel processing power of an FPGA.
Highlights
Built around the Intel Arria® 10 ARM® Processor-based SoC FPGA
Offers USB 3.0, PCIe® Gen3 x8 and Gigabit Ethernet interface
A complete and powerful embedded processing system in a compact, space-saving form factor
Large, high-bandwidth memory, with up to 4 GByte of DDR4 ECC SDRAM
High-bandwidth data transfer: PCIe® Gen3 x8 interface, and a high number of available LVDS pairs provide high-speed data I/O at low integration cost
Lowest power consumption due to the high-efficiency DC/DC converters
Support for Linux operating systems
Features
Intel Arria® 10 ARM® Processor-based SoC FPGA
ARM® dual-core Cortex™-A9
(32 bit, up to 1.5 GHz)
Intel Arria 10 20 nm FPGA fabric
Small form factor (74 × 54 mm)
286 user I/Os
18 ARM peripheral I/Os (SPI, SDIO, I2C, UART)
212 FPGA I/Os (single-ended or differential)
168 FPGA I/Os
44 FPGA I/Os shared with USB 3.0
56 MGT signals (clock and data)
Up to 4 GByte DDR4 ECC SDRAM
16 GByte eMMC flash
64 MByte quad SPI flash
PCIe® Gen3 x8
12 × 10.3125/12.5 Gbit/sec MGTs
Gigabit Ethernet
USB 3.0 device controller
USB 2.0 host/device
5 to 15 V supply voltage
Module Architecture
Click image to enlarge
Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.
Product Selection Matrix
Product Code
SoC FPGA
DDR4 SDRAM
PCIe
USB 3.0/FX3
Temp. Range
Status
ME-AA1-270-3E4-D11E
10AS027E4F29E3SG
2GB
✔
✔
0..+85°C
ME-AA1-270-3E4-D11E-NFX3
10AS027E4F29E3SG
2GB
✔
✘
0..+85°C
ME-AA1-270-2I2-D11E
10AS027E2F29I2SG
2GB
✔
✔
-40..+85°C
ME-AA1-270-2I2-D11E-NFX3
10AS027E2F29I2SG
2GB
✔
✘
-40..+85°C
ME-AA1-480-2I3-D12E
10AS048E3F29I2SG
4GB
✔
✔
-40..+85°C
ME-AA1-480-2I3-D12E-NFX3
10AS048E3F29I2SG
4GB
✔
✘
-40..+85°C
Custom Configurations
Click to view custom configuration options
TBC
TBC
TBC
TBC
Click on table to enlarge
Key:
Mass production
Sampling
Contact us
Minimum order quantities apply for custom module configurations. Please contact us.
We provide CNY prices with 13% VAT, please contact our China sales.
1+
30+
100+
1000+
10000+
1+
30+
100+
1000+
10000+
1+
30+
100+
1000+
10000+
我们在中国有分公司，提供人民币含税价，请联系kiddy.xu@enclustra.com
ME-AA1-270-3E4-D11E
✔
549
506
455
378
293
638
588
528
439
340
587
541
486
404
313
ME-AA1-270-3E4-D11E-NFX3
✔
537
496
444
369
284
624
576
516
429
330
575
530
475
395
304
ME-AA1-270-2I2-D11E
654
598
533
442
339
760
694
619
513
394
700
639
570
472
363
ME-AA1-270-2I2-D11E-NFX3
642
586
523
433
331
746
681
607
503
384
687
627
559
463
354
ME-AA1-480-2I3-D12E
✔
1106
1012
917
784
678
1284
1175
1065
911
787
1182
1082
981
839
725
ME-AA1-480-2I3-D12E-NFX3
✔
1094
1001
907
775
669
1270
1162
1053
900
777
1169
1070
969
829
715
Click on table to enlarge
1: For non-preferred configurations, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.
Mercury Heat Sink
Large Heat Dissipation
High performance devices like the Xilinx Zynq Ultrascale+ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.
The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.
The Mercury heatsink is provided as part of a heatsink accessory package including:
Heatsink body
Mounting material
Standard fan
Gap pad set
Design-in Kit – The Fast Way to the Market
The Enclustra Design-in Kits help shorten time-to-market for any Xilinx Zynq UltraScale+ MPSoC based application.
The design-in kits include everything you need to get started, also 2 AI example applications with all sources.
The examples are based on ResNet50 and Xilinx Vitis AI. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself.
more
Base Boards
Select one of these base boards to get started with development straight out of the box.
Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.
For commercial reasons, this file is only available to Enclustra customers - if you're already a customer, simply fill in your name, company and email address below and we'll send you the file as soon as possible (usually within 24 hours).
If you're not currently a customer, we'd appreciate if you could provide a short message about your project requirements, and anything else we can assist you with.
Document Request
After filling out your contact details you will get an Email with a download link.
If you're not currently a customer, we'd appreciate if you could provide a short message about your project requirements, and anything else we can assist you with.
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Mass production
Sampling
Contact us
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