Mercury+ AA1

Intel® Arria® 10 SoC Module

Mercury+ AA1 SoC Module Mercury+ AA1 SoC Module (front)
Mercury+ AA1 SoC Module (back)


The Mercury+ AA1 system-on-chip (SoC) module combines Intel's Arria 10 ARM Processor-based SoC FPGA with fast DDR4 ECC SDRAM, eMMC flash, quad SPI flash, Gigabit Ethernet PHY and an RTC and thus forms a high-performance embedded processing solution, combining the flexibility of a CPU system with the raw, real-time parallel processing power of an FPGA.



  • Built around the Intel Arria® 10 ARM® Processor-based SoC FPGA
  • Offers USB 3.0, PCIe® Gen3 x8 and Gigabit Ethernet interface
  • DDR4 SDRAM with Error Correction Code (ECC)
  • 9.6 GByte/s memory bandwith
  • Available in industrial-grade temperature range
  • Smaller than a credit card
  • Linux BSP and tool chain available
  • Powerful and compact FPGA board


  • A complete and powerful embedded processing system in a compact, space-saving form factor
  • Large, high-bandwidth memory, with up to 4 GByte of DDR4 ECC SDRAM
  • High-bandwidth data transfer: PCIe® Gen3 x8 interface, and a high number of available LVDS pairs provide high-speed data I/O at low integration cost
  • Lowest power consumption due to the high-efficiency DC/DC converters
  • Support for Linux operating systems


  • Intel Arria® 10 ARM® Processor-based SoC FPGA
    • ARM® dual-core Cortex™-A9
      (32 bit, up to 1.5 GHz)
    • Intel Arria 10 20 nm FPGA fabric
  • Small form factor (74 × 54 mm)
  • 286 user I/Os
    • 18 ARM peripheral I/Os (SPI, SDIO, I2C, UART)
    • 212 FPGA I/Os (single-ended or differential)
      • 168 FPGA I/Os
      • 44 FPGA I/Os shared with USB 3.0
    • 56 MGT signals (clock and data)
  • Up to 4 GByte DDR4 ECC SDRAM
  • 16 GByte eMMC flash
  • 64 MByte quad SPI flash
  • PCIe® Gen3 x8
  • 12 × 10.3125/12.5 Gbit/sec MGTs
  • Gigabit Ethernet
  • USB 3.0 device controller
  • USB 2.0 host/device
  • 5 to 15 V supply voltage

Module Architecture

Mercury AA1 Module ArchitectureClick image to enlarge

Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.

Product Selection Matrix

Product CodeSoC FPGADDR4 SDRAMPCIeUSB 3.0/FX3Temp. RangeStatus
ME-AA1-270-3E4-D11E 10AS027E4F29E3SG 2GB 0..+85°C
ME-AA1-270-3E4-D11E-NFX3 10AS027E4F29E3SG 2GB 0..+85°C no match
ME-AA1-270-2I2-D11E 10AS027E2F29I2SG 2GB -40..+85°C else
ME-AA1-270-2I2-D11E-NFX3 10AS027E2F29I2SG 2GB -40..+85°C no match
ME-AA1-480-2I3-D12E 10AS048E3F29I2SG 4GB -40..+85°C
ME-AA1-480-2I3-D12E-NFX3 10AS048E3F29I2SG 4GB -40..+85°C no match
Custom Configurations Click to view custom configuration options

Click on table to enlarge

Key: in-stock Mass production limited-quantities Sampling contact-us Contact us

Minimum order quantities apply for custom module configurations. Please contact us.


Show prices in: EUR USD CHF CNY

Product CodePreferred variant1EURUSDCHFWe provide CNY prices with 13% VAT, please contact our China sales.
1+30+100+1000+10000+1+30+100+1000+10000+1+30+100+1000+10000+ 我们在中国有分公司,提供人民币含税价,请联系

Click on table to enlarge

1: For non-preferred configurations, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.

Mercury Heat Sink

enclustra mercury heat sink hs3

Large Heat Dissipation

High performance devices like the Xilinx Zynq Ultrascale+ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.

The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.

The Mercury heatsink is provided as part of a heatsink accessory package including:

  • Heatsink body
  • Mounting material
  • Standard fan
  • Gap pad set

Design-in Kit – The Fast Way to the Market

enclustra design-in kit xu5

The Enclustra Design-in Kits help shorten time-to-market for any Xilinx Zynq UltraScale+ MPSoC based application. The design-in kits include everything you need to get started, also 2 AI example applications with all sources.

The examples are based on ResNet50 and Xilinx Vitis AI. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself. more

Base Boards

Select one of these base boards to get started with development straight out of the box.

Base BoardDescription
Mercury+ PE1 A feature-packed board with 3 different variants, compatible with all Mercury and Mercury+ modules.
Mercury+ ST1 A flexible board optimized for video applications and the perfect fit for our Mercury and Mercury+ modules.

Operating System Support

OS Details Availability



Available now

Target Applications

  • Embedded Computing
  • Data Acquisition
  • High-Speed Communications
  • Drive/Motion Control
  • Digital Signal Processing
  • Image Processing

Related Products

  • Mercury+ ST1 Base Board more
  • Mercury+ PE1 PCIe Base Board more
  • Universal Drive Controller IP Core more
  • derline; padding: 0px 10px 0px 0px; color: #074c97; background-position: 100% 3px;" href="en/products/ip-cores/">more



Support and Further Information

Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.