Andromeda XRU50

Andromeda XRU50 FPGA Module Andromeda XRU50 FPGA Module (front)
Andromeda XRU50 FPGA Module (back)

AMD’s Zynq UltraScale+ RFSoC

EARLY ACCESS

We offer an early-access program for this product. Please contact us if you would like to be part of this program.

Overview

The Enclustra Andromeda XRU50 RFSoC module provides remarkable RF performance in an integrated, compact, power-efficient package for next-generation RF systems. It is equipped with an advanced System-on-Chip (SoC) with numerous integrated RF-DACs and RF-ADCs. This enables the direct synthesis of RF signals, eliminating the need for complex analog circuitry and simplifying FPGA system designs. The module comes in one of the most compact form factors available today on the market, delivering exceptional RF performance without compromise. The Andromeda XRU50 RFSoC offers unparalleled flexibility, making it ideal for diverse embedded applications - from next-generation wireless & satellite communication systems, test & measurement equipment and even quantum computing.

 

Highlights

  • 8 × RF-ADC up to 5 Gsps and 8 × RF-DAC up to 9.85 Gsps integrated.
  • Built around AMD’s Zynq™ Ultrascale+™ RFSoC FPGA
    • Quad core Cortex A53 at 1.5GHz
  • Available in industrial temperature range
  • DDR4 SDRAM with Error Correction Code (ECC)
  • Five ADM6-60 Samtec connectors with up to 202 user I/Os
  • Linux BSP and tool chain available soon
  • Powerful and compact FPGA board
  • Offers up to PCIe Gen3 x16 and Gen2 × 4 and 2 × Gigabit Ethernet and USB3.0 interface
Enclustra Design Services

Benefits

  • Integrated high-performance SoC
  • A complete and powerful RF processing system in a low-power, compact form factor for unmatched flexibility
  • Direct RF signal synthesis eliminates complex analog circuitry.
  • Large, high bandwidth memory with up to 8GB of DDR4 ECC SDRAM
  • High number of transceivers available
  • High number of user I/Os and FPGA logic resources for powerful applications
  • Support for Linux operating system.
 

Features

  • AMD’s Zynq™ Ultrascale+™ RFSoC FPGA
    • Quad core Cortex A53 at 1.5GHz
  • RF: 8 × ADC @ 14 bit up to 5 Gsps | 8 × DAC @ 14 bit up to 9.85 Gsps
  • 202 user I/Os:
    • 156 HP (1-1.8V)
    • 24 HD (1.2-3.3V)
    • 22 MIO (1.8-3.3V)
  • MGT: 16 PL GTY (32 Gbps) and 4 PS GTR (6 Gbps)
  • APU: 4 × Cortex A53 @ 1.3 GHz
  • 8 GB DDR4-2400 x72 ECC memory (PS)
  • 8 GB DDR4-2666 x64 memory (PL)
  • 16 GB eMMC flash (PS)
  • 64 MB QSPI flash (PS)
  • 2 × Gigabit Ethernet PHY (PS + PL)
  • USB 2.0 PHY (USB 3.0 using PS GTR)
  • 12V single supply
  • Small form factor Andromeda L 80 × 64 mm

Module Architecture

Andromeda XRU50 Module ArchitectureClick image to enlarge

Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.

Product Selection Matrix

Model Name FPGA Memory Temp. Range Status
AM-XRU50-48DR-2I-D4E XCZU48DR-2FFVG1517I PS: 8 GB x72 ECC DDR4-2400 | PL: 8 GB x64 DDR4-2666 -40..+85°C no match
AM-XRU50-43DR-1I-D3E XCZU43DR-1FFVG1517I PS: 4 GB x72 ECC DDR4-2400 | PL: 4 GB x64 DDR4-2400 -40..+85°C no match

Click on table to enlarge

Key: in-stock Active limited-quantities Early Access contact-us Contact us

Minimum order quantities apply for custom module configurations. Please contact us.

Pricing

Early Access Design-In-Kit price is 14’895 CHF – currently available!

Contact us for more pricing information.

Andromeda Heat Sink

Andromeda Heatsink

Keep your Andromeda L SoC module cool with the perfect fit.

The Andromeda L heat sink is a low-profile, comprehensive cooling solution designed specifically for Andromeda L SoC modules. It efficiently covers the entire module surface, ensuring optimal thermal performance.

The Andromeda heatsink is provided as part of a heatsink accessory package including:

  • Heatsink body
  • Gap pad for optimal heat transfer
  • Durable mounting material for secure attachment
  • Standard fan for active cooling.

Baseboard

Base Board Description
Andromeda ST9 Dedicated baseboard optimized for the RFSoC product series.
 

Operating System Support

OS Details Availability

linux

Linux

  • BSP support for:
    • DDR4 SDRAM
    • Quad SPI flash
    • USB host
    • Gigabit Ethernet
    • I2C
  • U-boot bootloader
  • Comprehensive user documentation.
Coming soon

Target Applications

  • Wireless communications, 5G (Software defined radios (SDRs); next-generation Wi-Fi and Bluetooth Devices)
  • Satellite Communications
  • Advanced Phased-Array Radar Solutions
  • Test and Measurement.
  • Quantum Computing.
     


Ordering

  

Support and Further Information

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Empower innovation across various industries and enjoy exceptional RF performance with the Enclustra Andromeda XRU50 RFSoC module.

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Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.