Overview

The Enclustra Andromeda XRU50 RFSoC module provides remarkable RF performance in an integrated and compact, power-efficient package for next-generation RF systems. It is equipped with an advanced System-on-Chip (SoC) with a large count of RF-DACs and RF-ADCs integrated, therefore enabling direct synthesis of RF signals, eliminating the requirement for complex analog circuitry. The module comes the most compact form factor available today on the market, delivering exceptional RF performance without compromise and offers unparalleled flexibility for diverse applications.

Highlights

• 8 x RF-ADC up to 5 Gsps and 8 x RF-DAC up to 9.85 Gsps integrated
• Built around AMD’s Zynq Ultrascale+ RFSoC FPGA
  • Quad core Cortex A53 at 1.5GHz
• Available in industrial temperature range
• DDR4 SDRAM with Error Correction Code (ECC)
• Five ADM6-60 Samtec connectors with up to 202 user I/Os
• Linux BSP and tool chain available soon
• Powerful and compact FPGA board
• Offers up to PCIe Gen3 x16 and Gen2 x 4 and 2 x Gigabit Ethernet and USB3.0 interface

Benefits

• A complete and powerful RF processing system in a low-power, compact form factor
• Large, high bandwidth memory with up to 8GB of DDR4 ECC SDRAM
• High number of transceivers available
• High number of user I/Os and FPGA logic resources for powerful applications
• Support for Linux operating system.

Features

• AMD’s Zynq Ultrascale+ RFSoC FPGA
  • Quad core Cortex A53 at 1.5GHz
• RF: 8 x ADC @ 12 bit up to 5 Gsps | 8 x DAC @ 14 bit up to 9.85 Gsps
• 202 user I/Os:
  • 156 HP (1-1.8V)
  • 24 HD (1.2-3.3V)
  • 22 MIO (1.8-3.3V)
• MGT: 16 PL GTY (32 Gbps) and 4 PS GTR (6 Gbps)
• APU: 4 x Cortex A53 @ 1.3 GHz
• 8 GB DDR4-2400 x72 ECC memory (PS)
• 8 GB DDR4-2666 x64 memory (PL)
• 16 GB eMMC flash (PS)
• 64 MB QSPI flash (PS)
• 2 x Gigabit Ethernet PHY (PS + PL)
• USB 2.0 PHY (USB 3.0 using PS GTR)
• 12V single supply
• Small form factor Andromeda L 80x64 mm

Module Architecture

Click image to enlarge

Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.

Product Selection Matrix

Model Name	FPGA	Memory	Temp. Range	Status
AM-XRU50-48DR-2I-D4E	XCZU48DR-2FFVG1517I	PS: 8 GB x72 ECC DDR4-2400 | PL: 8 GB x64 DDR4-2666	-40..+85°C
AM-XRU50-43DR-1I-D3E	XCZU43DR-1FFVG1517I	PS: 4 GB x72 ECC DDR4-2400 | PL: 4 GB x64 DDR4-2400	-40..+85°C

Click on table to enlarge

Key: Active Early Access Contact us

Minimum order quantities apply for custom module configurations. Please contact us.

Pricing

Early Access Design-In-Kit price is 14’895 CHF – currently available!

Contact us for more pricing information.

Andromeda Heat Sink

The Andromeda L heat sink is an optimal cooling solution for Andromeda L SoC modules - it is low-profile and covers the whole module surface.

The Andromeda heatsink is provided as part of a heatsink accessory package including:

• Heatsink body
• Mounting material
• Standard fan
• Gap pad.

Baseboard

Operating System Support

Target Applications

• Software defined radios (5G wireless communications)
• Phased array radar
• Test and measurement
• Quantum computing

Ordering

• Order/Enquiry form
• General Business Conditions
• We deliver worldwide!

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