Mercury Heat Sinks
The Mercury ACC-HS4 (left) and ACC-HS3 (right) heat sink kits contain a heat sink body, a fan, thermal gap pads and all necessary mounting material. |
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Large Heat Dissipation High performance devices like the Xilinx Zynq Ultrascale+ MPSoC or Altera Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled. |
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The Mercury heat sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1. The Mercury heat sink is provided as part of a heat sink kit including:
There are two types of Mercury heat sink kits available: ACC-HS3-SET & ACC-HS4-SET.
1: For the Mercury ZX1 (64 × 54 mm) and for Mercury+ SA2 (74 × 54 mm) the heat sink does not cover the entire module surface. |
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Product Selection Matrix
Click on table to enlarge. The Mercury KX1 is not supported.
Key:
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Early Access
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