The Mercury ZX1 system-on-chip (SoC) module combines AMD Zynq™ 7000-series All Programmable SoC
device with fast DDR3 SDRAM, NAND flash, quad SPI flash, a Gigabit Ethernet PHY, dual Fast Ethernet
PHY and an RTC and thus forms a complete and powerful embedded processing system.
Highlights
Built around AMD Zynq™ 7000 All Programmable SoC
Combines the flexibility of a CPU system with the parallel processing power and real-time
capabilities of an FPGA system
Offers PCIe® Gen2 x8, USB 2.0, and Gigabit Ethernet interfaces
Dual Fast Ethernet for Industrial Ethernet like PROFINET, EtherCAT, POWERLINK or Ethernet/IP
Available in industrial temperature range
64 × 54 mm form factor with dual 168-pin Hirose FX10 connectors has minimal footprint
High-bandwidth memory - independent PS and PL channels are ideal for most applications
High-bandwidth data transfer
A powerful PCIe Gen2 x8 interface, and a high number of available LVDS pairs provide high-speed
data I/O at low integration cost
Low-latency networking Gigabit Ethernet interface provides fast networking capabilities
Dual Fast Ethernet PHY for Industrial Ethernet
Support for Linux and VxWorks operating systems
Lowest power consumption due to the high-efficiency DC/DC converters
Features
AMD Zynq™ 7000-series SoC FPGA
ARM® dual-core Cortex™-A9
(32 bit, up to 800 MHz)
AMD Kintex™ 7 28nm FPGA fabric
Zynq-7030:
170 total user I/Os
12 ARM peripheral I/Os (SPI, SDIO, CAN, I2C, UART) ) shared with FPGA I/Os
138 FPGA I/Os (single-ended or differential)
20 MGT signals (clock and data)
Zynq-7035/45:
178 total user I/Os
12 ARM peripheral I/Os (SPI, SDIO, CAN, I2C, UART) shared with FPGA I/Os
126 FPGA I/Os (single-ended or differential)
40 MGT signals (clock and data)
1 GByte DDR3L SDRAM (PS)
256 MByte DDR3L SDRAM (PL)
PCIe Gen2 x8
4 × 6.6 Gbps MGTs (Zynq-7030)
8 × 6.6 Gbps MGTs (Zynq-7035)
8 × 10.3125 Gbps MGTs (Zynq-7045)
512 MB NAND flash
64 MB quad SPI flash
Gigabit Ethernet and USB 2.0 OTG
Two Fast Ethernet PHYs
5 to 15V supply voltage
Coating and Burn-In for Enhanced Realibility
Coating and burn-in enhances the reliability and longevity of Enclustra SOMs. The protective coating shields the SOM from environmental stressors like dust, moisture, and chemicals, ensuring optimal performance in harsh conditions. Additionally, the rigorous burn-in process identifies and mitigates potential early-life failures by subjecting each unit to extended periods of thermal stress. These services guarantee superior durability and consistent functionality for critical applications. Please contact us for more information.
Module Architecture
Click
image to enlarge
Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.
We provide CNY prices with 13% VAT, please contact our China sales.
1+
30+
100+
1000+
10000+
1+
30+
100+
1000+
10000+
1+
30+
100+
1000+
10000+
我们在中国有分公司，提供人民币含税价，请联系sales.cn@enclustra.com
ME-ZX1-30-2I-D10
✔
699
610
526
429
326
721
630
543
442
336
678
592
511
415
316
ME-ZX1-35-1I-D10
✔
1148
1063
919
721
517
1184
1097
948
744
533
1114
1032
892
700
501
ME-ZX1-45-2I-D10-P
✔
1254
1136
1017
855
674
1335
1210
1083
911
718
1216
1102
986
830
654
Click on table to enlarge
1: For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.
Mercury Heat Sink
Large Heat Dissipation
High performance devices like the AMD Zynq™ Ultrascale+™ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.
The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.
The Mercury heatsink is provided as part of a heatsink accessory package including:
Heatsink body
Mounting material
Standard fan
Gap pad set
Design-in Kit – The Fast Way to the Market
The Enclustra Design-in Kits help shorten time-to-market for any AMD Zynq™ UltraScale+™ MPSoC based application.
The design-in kits include everything you need to get started, also 2 AI example applications with all sources.
The examples are based on ResNet50 and AMD Vitis™ Software Platform. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself.
more
Base Boards
Select one of these base boards to get started with development straight out of the box.
a versatile PCIe® base board equipped with a multitude of I/O interfaces compatible with all Mercury and Mercury+ modules. Especially suited for high-speed communication applications thanks to the QSFP+/SFP+ interfaces.
Information contained on this web page is subject to change without notice. Actual product may differ in
appearance from images shown on this web page.
For commercial reasons, this file is only available to Enclustra customers - if you're already a customer, simply fill in your name, company and email address below and we'll send you the file as soon as possible (usually within 24 hours).
If you're not currently a customer, we'd appreciate if you could provide a short message about your project requirements, and anything else we can assist you with.
Document Request
After filling out your contact details you will get an Email with a
download link.
If you're not currently a customer, we'd appreciate if you could provide a
short message about your project requirements, and anything else we can
assist you with.
Need help with your FPGA/SoC design?
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