Mercury+ XU7

Mercury+ XU7 FPGA Module Mercury+ XU7 FPGA Module (front)
Mercury+ XU7 FPGA Module (back)

Xilinx® Zynq® UltraScale+ MPSoC Module

Overview

The Mercury+ XU7 system-on-chip (SoC) module combines Xilinx's Zynq UltraScale+™ MPSoC-series device with fast DDR4 ECC SDRAM, eMMC flash, quad SPI flash, dual Gigabit Ethernet PHY, dual USB 3.0 and thus forms a complete and powerful embedded processing system.

Highlights

  • Built around Xilinx's Zynq Ultrascale+™ MPSoC
  • Two independent memory channels for PS (DDR4 ECC SDRAM) and PL (DDR4 SDRAM)
  • Up to 28.8 GByte/sec memory bandwidth
  • Offers PCIe® Gen2 x4, 2x USB 3.0 and 2x Gigabit Ethernet interfaces
  • Available in industrial temperature range
  • Three 168-pin Hirose FX10 connectors with 236 user I/Os
  • Linux BSP and tool chain available
  • Powerful and compact FPGA board

Benefits

  • A complete and powerful embedded processing system in a compact, space-saving form factor
  • Large, high-bandwidth memory, with up to 8 GByte of DDR4 ECC SDRAM (PS) and up to 4 GByte of DDR4 RAM (PL)
  • High-bandwidth data transfer: PCIe® Gen2 x4, USB 3.0, and a high number of available LVDS pairs provide high-speed data I/O at low integration cost
  • Lowest power consumption due to the high-efficiency DC/DC converters
  • Support for Linux embedded operating system

Features

  • Xilinx® Zynq Ultrascale+™ MPSoC
    • ARM® quad-core Cortex™-A53
    • ARM dual-core Cortex™-R5
    • Mali-400MP2 GPU
    • 16nm FinFET+ FPGA fabric
  • Up to 8 GB DDR4 ECC SDRAM (PS)
  • Up to 4 GB DDR4 SDRAM (PL)
  • 64 MB QSPI flash
  • 16 GB eMMC flash
  • PCIe® Gen2 ×4
  • 20 × 6/12.5/15 Gbit/sec MGT
  • 2 × Gigabit Ethernet
  • 2 × USB 3.0
  • 2 × USB 2.0 (host & host/device)
  • Up to 747,000 LUT4-eq
  • 236 user I/Os
    • 14 ARM peripherals
    • 122 FPGA I/Os
    • 100 MGT signals (clock and data)
  • 5 to 15 V single supply
  • Small form factor (74 × 54 mm)

Module Architecture

Mercury+ XU7 Module ArchitectureClick image to enlarge

Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.

Product Selection Matrix

Product CodeMPSoCDDR4 ECC SDRAM (PS)DDR4 SDRAM (PL)Temp. RangeStatus
ME-XU7-6EG-1I-D11E XCZU6EG-1FFVC900I 2GB 1GB -40..+85°C
ME-XU7-9EG-2I-D12E XCZU9EG-2FFVC900I 4GB 2GB -40..+85°C else
ME-XU7-15EG-2I-D12E XCZU15EG-2FFVC900I 4GB 2GB -40..+85°C
Custom Configurations Click to view custom configuration options
TBC
TBC TBC TBC

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Key: in-stock Mass production limited-quantities Sampling contact-us Contact us

Minimum order quantities apply for custom module configurations. Please contact us.

Pricing

Show prices in: EUR USD CHF CNY

Product CodePreferred variant1EURUSDCHFWe provide CNY prices with 13% VAT, please contact our China sales.
1+30+100+1000+10000+1+30+100+1000+10000+1+30+100+1000+10000+ 我们在中国有分公司,提供人民币含税价,请联系kiddy.xu@enclustra.com
ME-XU7-6EG-1I-D11E1250114110268787311452132511921020849133712201097939782
ME-XU7-9EG-2I-D12E195616711491127610592271194017321482123020911786159513641132
ME-XU7-15EG-2I-D12E212819471771154413342471226120571793154922752082189416511426

Click on table to enlarge

1: For non-preferred configurations, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.

Mercury Heat Sink

enclustra mercury heat sink hs3

Large Heat Dissipation

High performance devices like the Xilinx Zynq Ultrascale+ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.

The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.

The Mercury heatsink is provided as part of a heatsink accessory package including:

  • Heatsink body
  • Mounting material
  • Standard fan
  • Gap pad set

Design-in Kit – The Fast Way to the Market

enclustra design-in kit xu5

The Enclustra Design-in Kits help shorten time-to-market for any Xilinx Zynq UltraScale+ MPSoC based application. The design-in kits include everything you need to get started, also 2 AI example applications with all sources.

The examples are based on ResNet50 and Xilinx Vitis AI. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself. more

Base Boards

Select one of these base boards to get started with development straight out of the box.

Base BoardDescription
Mercury+ PE1 A feature-packed board with 3 different variants, compatible with all Mercury and Mercury+ modules.
Mercury+ ST1 A flexible board optimized for video applications and the perfect fit for our Mercury and Mercury+ modules.

Warning: Due to the pinout assignments (pin types and I/O voltage levels) on module connectors B and C, affecting the FMC interfaces, the compatibility of the Mercury+ XU7 SoC module to the Mercury+ PE1 base board is limited. It is recommended to check the FMC card pinout in detail with the Enclustra Mercury Master Pinout and with the module and base board schematics.

 

Operating System Support

OS Details EBE BSP Petalinux BSP

linux

Linux

Available now Available now

Target Applications

  • Embedded Computing
  • Data Acquisition
  • High-Speed Communications
  • Drive/Motion Control
  • Digital Signal Processing
  • Image Processing
  

Related Products

  • Mercury+ ST1 Base Board more
  • Mercury+ PE1 PCIe Base Board more
  • Universal Drive Controller IP Core more


Ordering

  

Support and Further Information


Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.