The Mercury CA1 module offers high-performance yet low cost Intel Cyclone IV FPGAs in conjunction with standard interfaces like USB 2.0 and Gigabit Ethernet.
With its powerful standard interfaces, the many LVDS capable I/Os, the large DDR2 SDRAM and the many hardware multipliers it is equally suited for digital signal processing, networking, high-speed I/O as well as SoPC applications utilizing the Intel Nios® II soft processor.
The Mercury CA1 FPGA board reduces development effort, redesign risk and improves time-to-market.
Highlights
Features the latest Intel low-cost FPGA family
FTDI-based USB 2.0 High-Speed interface
Gigabit Ethernet PHY for high-bandwidth/low-latency networking
Smaller than a credit card
Only requires a single supply voltage (5..15V)
Powerful and compact FPGA board
Benefits
Vast amount of parallel processing power for DSP applications (up to 200 multipliers at 260 MHz = 52 GMAC/s)
High-bandwidth data I/O due to the large number of available LVDS pairs
Simple and low-cost integration due to standard interfaces (USB, Gigabit Ethernet), single supply voltage and 2.5V / 3.3V power outputs
Many IP cores are available from Intel, Enclustra and third parties
Features
Intel Cyclone IV E FPGA
Small form factor (56 x 54 mm, dual 168-pin Hirose FX10 connectors)
25 differential pairs and 98 single-ended user I/Os or 146 single-ended user I/Os (168 with custom configuration)
16 MB SPI Flash
Up to 256 MB DDR2 SDRAM
FTDI USB 2.0 High-Speed interface
Gigabit Ethernet PHY
High-power 8A core power supply
Module Architecture
Click image to enlarge
Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.
Product Selection Matrix
Product Code
FPGA
SPI Flash
DDR2 SDRAM
Gigabit Ethernet
USB 2.0
Temp. Range
Status
ME-CA1-75-8C-D7
EP4CE75F23C8N
16MB
128MB
✔
✔
0..+70°C
ME-CA1-115-7I-D8
EP4CE115F23I7N
16MB
256MB
✔
✔
-40..+85°C
Custom Models
Click to view custom models options
EP4CE
30
F23
C
6
N
40
I
7
LN
55
8
75
115
✘ 8MB 16MB
✘ 128MB 256MB
✘ ✔
✘ ✔
0..+70°C -40..+85°C
Click on table to enlarge
Key:
Active
Early Access
Contact us
Minimum order quantities apply for custom module configurations. Please contact us.
We provide CNY prices with 13% VAT, please contact our China sales.
1+
30+
1+
30+
1+
30+
我们在中国有分公司,提供人民币含税价,请联系sales.cn@enclustra.com
ME-CA1-75-8C-D7
✔
520
460
536
475
504
446
ME-CA1-115-7I-D8
629
544
649
562
610
529
Click on table to enlarge
1: For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.
Mercury Heat Sink
Large Heat Dissipation
High performance devices like the AMD Zynq™ Ultrascale+™ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.
The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.
The Mercury heat sink is provided as part of a heat sink kit including:
Heat sink body
Mounting material
Standard fan
Gap pad set
Design-in Kit – The Fast Way to the Market
The Enclustra Design-in Kits help shorten time-to-market for any AMD Zynq™ UltraScale+™ MPSoC based application.
The design-in kits include everything you need to get started, also 2 AI example applications with all sources.
The examples are based on ResNet50 and AMD Vitis™ Software Platform. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself.
more
Base Boards
Select one of these base boards to get started with development straight out of the box.
a versatile PCIe® base board equipped with a multitude of I/O interfaces compatible with all Mercury and Mercury+ modules. Especially suited for high-speed communication applications thanks to the QSFP+/SFP+ interfaces.
Information contained in this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.
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