Mercury CA1

Intel® Cyclone® IV E FPGA Module

Mercury CA1 FPGA Module Mercury CA1 FPGA Module (front)
Mercury CA1 FPGA Module (back)

End of life (EOL)

This product is End-of-Life. Last time buy is December 31, 2023. Please contact us for more information.

Upgrade to the Mercury SA1

If you want to upgrade your current Mercury CA1 solution, then have a look at the Mercury SA1.

Overview

The Mercury CA1 module offers high-performance yet low cost Intel Cyclone IV FPGAs in conjunction with standard interfaces like USB 2.0 and Gigabit Ethernet.

With its powerful standard interfaces, the many LVDS capable I/Os, the large DDR2 SDRAM and the many hardware multipliers it is equally suited for digital signal processing, networking, high-speed I/O as well as SoPC applications utilizing the Intel Nios® II soft processor.

The Mercury CA1 FPGA board reduces development effort, redesign risk and improves time-to-market.

Highlights

  • Features the latest Intel low-cost FPGA family
  • FTDI-based USB 2.0 High-Speed interface
  • Gigabit Ethernet PHY for high-bandwidth/low-latency networking
  • Smaller than a credit card
  • Only requires a single supply voltage (5..15V)
  • Powerful and compact FPGA board

Benefits

  • Vast amount of parallel processing power for DSP applications (up to 200 multipliers at 260 MHz = 52 GMAC/s)
  • High-bandwidth data I/O due to the large number of available LVDS pairs
  • Simple and low-cost integration due to standard interfaces (USB, Gigabit Ethernet), single supply voltage and 2.5V / 3.3V power outputs
  • Simplified carrier board design (typically 4 layers)
  • Many IP cores are available from Intel, Enclustra and third parties
 

Features

  • Intel Cyclone IV E FPGA
  • Small form factor (56 x 54 mm, dual 168-pin Hirose FX10 connectors)
  • 25 differential pairs and 98 single-ended user I/Os or 146 single-ended user I/Os (168 with custom configuration)
  • 16 MB SPI Flash
  • Up to 256 MB DDR2 SDRAM
  • FTDI USB 2.0 High-Speed interface
  • Gigabit Ethernet PHY
  • High-power 8A core power supply

Module Architecture

Mercury CA1 Module ArchitectureClick image to enlarge

Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.

Product Selection Matrix

Product CodeFPGASPI FlashDDR2 SDRAMGigabit EthernetUSB 2.0Temp. RangeStatus
ME-CA1-75-8C-D7 EP4CE75F23C8N 16MB 128MB 0..+70°C
ME-CA1-115-7I-D8 EP4CE115F23I7N 16MB 256MB -40..+85°C no match
Custom Models Click to view custom models options
EP4CE 30 F23 C 6 N
  40   I 7 LN
  55     8  
  75        
  115        

8MB
16MB

128MB
256MB


0..+70°C
-40..+85°C

Click on table to enlarge

Key: in-stock Active limited-quantities Early Access contact-us Contact us

Minimum order quantities apply for custom module configurations. Please contact us.

Pricing

Show prices in: EUR USD CHF CNY

Product CodePreferred model1EURUSDCHFWe provide CNY prices with 13% VAT, please contact our China sales.
1+30+100+1000+10000+1+30+100+1000+10000+1+30+100+1000+10000+ 我们在中国有分公司,提供人民币含税价,请联系sales.cn@enclustra.com
ME-CA1-75-8C-D7473419368290208488432380299215459406357281202
ME-CA1-115-7I-D8572495429331235590511443341242555481417321228

Click on table to enlarge

1: For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.

Mercury Heat Sink

enclustra mercury heat sink hs3

Large Heat Dissipation

High performance devices like the Xilinx Zynq Ultrascale+ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.

The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.

The Mercury heatsink is provided as part of a heatsink accessory package including:

  • Heatsink body
  • Mounting material
  • Standard fan
  • Gap pad set

Design-in Kit – The Fast Way to the Market

enclustra design-in kit xu5

The Enclustra Design-in Kits help shorten time-to-market for any Xilinx Zynq UltraScale+ MPSoC based application. The design-in kits include everything you need to get started, also 2 AI example applications with all sources.

The examples are based on ResNet50 and Xilinx Vitis AI. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself. more

Base Boards

Select one of these base boards to get started with development straight out of the box.

Base BoardDescription
Mercury+ ST1 A flexible board optimized for video applications and the perfect fit for our Mercury and Mercury+ modules.
Mercury+ PE3 a versatile PCIe® base board equipped with a multitude of I/O interfaces compatible with all Mercury and Mercury+ modules. Especially suited for high-speed communication applications thanks to the QSFP+/SFP+ interfaces.
Mercury+ PE1 A feature-packed board with 3 different variants, compatible with all Mercury and Mercury+ modules.

Reference Design

Mercury CA1 Qsys Reference Design

Click image to enlarge

The Mercury CA1 reference design consists of the following deliverables:

  • Precompiled FPGA configuration bitstream containing Qsys system featuring the following functional blocks:
    • Nios II CPU
    • DDR2 SDRAM controller
    • SPI master, UART (FTDI), JTAG UART
    • Timer, GPIO
  • Console-based demo applications (including source code and SDK workspace)
    • DDR2 / SPI Flash memory tests
    • UART access
  • Documentation (also explaining how to customize and generate the Qsys system).

Please contact us via email for availability information.

Target Applications

  • Digital Signal Processing
  • Video Processing
  • Audio Processing
  • Motion Control
  • Software Defined Radio
  • Communications
  • Embedded Computing
  • Networking
  

Related Products

  • Mercury+ PE1 PCIe Base Board more


Ordering

 

Support and Further Information


Information contained in this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.