Mercury+ XU61

Mercury+ XU61 FPGA Module Mercury+ XU61 FPGA Module (front)
Mercury+ XU61 FPGA Module (back)

IN DEVELOPMENT

This product is currently in development – for more detailed information on availability, feel free to get in touch.

Overview

The Mercury+ XU61 system-on-chip (SoC) module combines AMD's Zynq UltraScale+™ MPSoC-series device with LPDDR4 SDRAM, eMMC flash, quad SPI flash, Gigabit Ethernet PHY, USB 3.0 and thus forms a complete and powerful embedded processing system, optimized for low-power consumption applications.

 

Highlights

  • Built around AMD's Zynq Ultrascale+™ MPSoC Low Power Grade
  • LPDDR4 SDRAM (PS side)
  • 9.6 GByte/sec memory bandwidth
  • Offers PCIe® Gen3 x4, PCIe Gen2 x4, 2x USB 3.0 and 1x PS Gigabit Ethernet interfaces.
  • Available in industrial temperature range
  • Three 168-pin Hirose FX10 connectors with up to 254 user I/Os
  • Linux BSP and tool chain available
  • Low-power optimized FPGA board
Enclustra Design Services

Benefits

  • A complete and low-power optimized embedded processing system in a compact, space-saving form factor
  • Large, high-bandwidth memory, with up to 2 GByte of LPDDR4 SDRAM (PS)
  • High-bandwidth data transfer: PCIe® Gen3 x4, PCIe Gen2 x4, USB 3.0 at low integration cost
  • Lowest power consumption due to the high-efficiency DC/DC converters, low-power grade FPGA SoC and LPDDR4
  • Support for Linux operating system
 

Features

  • AMD Zynq™ Ultrascale+™ MPSoC Low-Power Grade
    • ARM® dual-/quad-core Cortex™-A53
    • ARM dual-core Cortex™-R5
    • Mali-400MP2 GPU (only for EG/EV models)
    • H.264 / H.265 Video Codec (only for EV models)
    • 16nm FinFET+ FPGA fabric
  • Up to 2 GB LPDDR4 SDRAM (PS)
  • 64 MB QSPI flash
  • 16 GB eMMC flash
  • PCIe® Gen3 ×4 and PCIe® Gen2 ×4
  • Gigabit Ethernet (PS)
  • USB 2.0/3.0 (host/device)
  • Up to 256,200 system logic cells
  • Up to 254 user I/Os
    • 14 ARM peripherals
    • 240 FPGA I/Os (92 HD + 144 HP + 4 LS)
  • MGT signals ZU2CG/ZU2EG/ZU3EG:
    • 4 MGT channels:
      • 4 GTR channels @ 6 Gbit/s
    • 4 reference clock inputs:
      • 4 GTR reference clock inputs
  • MGT signals ZU4CG/ZU4EV/ZU5EV:
    • 8 MGT channels:
      • 4 GTH channels @ 12.5 Gbit/s
      • 4 GTR channels @ 6 Gbit/s
    • 6 reference clock inputs:
      • 2 GTH reference clock inputs
      • 4 GTR reference clock inputs12 V single supply
  • 12 V single supply
  • Small form factor (65 × 54 mm)

Module Architecture

Mercury+ XU61 Module ArchitectureClick image to enlarge

Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.

Product Selection Matrix

Product Code Preferred Model MPSoC LPDDR4 SDRAM (PS) Temp. Range Status
ME-XU61-2CG-L1I4524-D9-NU XCZU2CG-L1SFVC784I4524 512MB -40..+85°C no match
ME-XU61-4CG-1E4524-D11 XCZU4CG-1SFVC784E4524 2GB 0..+85°C no match
ME-XU61-2EG-L1I4524-D11 XCZU2EG-L1SFVC784I4524 2GB -40..+85°C no match

Click on table to enlarge

Key: in-stock Active limited-quantities Early Access contact-us Contact us

Pricing

Price Upon Request

Mercury Heat Sink

enclustra mercury heat sink hs3

Large Heat Dissipation

High performance devices like the AMD Zynq™ Ultrascale+™ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.

The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.

The Mercury heatsink is provided as part of a heatsink accessory package including:

  • Heatsink body
  • Mounting material
  • Standard fan
  • Gap pad set

Design-in Kit – The Fast Way to the Market

enclustra design-in kit xu5

The Enclustra Design-in Kits help shorten time-to-market for any AMD Zynq™ UltraScale+™ MPSoC based application. The design-in kits include everything you need to get started, also 2 AI example applications with all sources.

The examples are based on ResNet50 and AMD Vitis™ Software Platform. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself. more

Base Boards

Select one of these base boards to get started with development straight out of the box.

Base BoardDescription
Mercury+ ST1 A flexible board optimized for video applications and the perfect fit for our Mercury and Mercury+ modules.
Mercury+ PE3 a versatile PCIe® base board equipped with a multitude of I/O interfaces compatible with all Mercury and Mercury+ modules. Especially suited for high-speed communication applications thanks to the QSFP+/SFP+ interfaces.
Mercury+ PE1 A feature-packed board with 3 different variants, compatible with all Mercury and Mercury+ modules.
 

Operating System Support

OS Details EBE BSP Petalinux BSP

linux

Linux

Available now Available now

Target Applications

  • Embedded Computing
  • Data Acquisition
  • High-Speed Communications
  • Drive/Motion Control
  • Digital Signal Processing
  • Image Processing
  • Test and Measurement
  • Low-Power Applications
  

Related Products

  • Mercury+ ST1 Base Board more
  • Mercury+ PE1 PCIe Base Board more
  • Universal Drive Controller IP Core more


Ordering

 

Support and Further Information


Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.