Mercury+ XU8 Support Packages
Overview
The Mercury+ XU8 system-on-chip (SoC) module combines Xilinx's Zynq UltraScale+™ MPSoC-series device with fast DDR4 ECC SDRAM, eMMC flash, quad SPI flash, dual Gigabit Ethernet PHY, dual USB 3.0 and thus forms a complete and powerful embedded processing system.
Highlights
- Built around Xilinx's Zynq Ultrascale+™ MPSoC
- Two independent memory channels for PS (DDR4 ECC SDRAM) and PL (DDR4 SDRAM)
- Up to 28.8 GByte/sec memory bandwidth
- Offers PCIe® Gen3 x16, PCIe Gen2 x4, 2x USB 3.0 and 2x Gigabit Ethernet interfaces
- Available in industrial temperature range
- Three 168-pin Hirose FX10 connectors with 236 user I/Os
- Linux BSP and tool chain available
- Powerful and compact FPGA board
Benefits
- A complete and powerful embedded processing system in a compact, space-saving form factor
- Large, high-bandwidth memory, with up to 8 GByte of DDR4 ECC SDRAM (PS) and up to 4 GByte of DDR4 RAM (PL)
- High-bandwidth data transfer: PCIe® Gen3 x16, PCIe Gen2 x4, USB 3.0, and a high number of available LVDS pairs provide high-speed data I/O at low integration cost
- Lowest power consumption due to the high-efficiency DC/DC converters
- Support for Linux embedded operating system
Features
- Xilinx® Zynq Ultrascale+™ MPSoC
- ARM® quad-core Cortex™-A53 (CG models: dual-core)
- ARM dual-core Cortex™-R5
- Mali-400MP2 GPU (only for EV models)
- H.264 / H.265 Video Codec (only for EV models)
- 16nm FinFET+ FPGA fabric
- Up to 8 GB DDR4 ECC SDRAM (PS)
- Up to 4 GB DDR4 SDRAM (PL)
- 64 MB QSPI flash
- 16 GB eMMC flash
- PCIe® Gen3 ×16 and PCIe Gen2 ×4
- 20 × 6/12.5/15 Gbit/sec MGT
- 2 × Gigabit Ethernet
- 2 × USB 3.0
- 2 × USB 2.0 (host & host/device)
- Up to 504,000 LUT4-eq
- 236 user I/Os
- 14 ARM peripherals
- 122 FPGA I/Os
- 100 MGT signals (clock and data)
- 5 to 15 V single supply
- Small form factor (74 × 54 mm)
Module Architecture
Click image to enlarge
Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.
Product Selection Matrix
| Product Code | MPSoC | DDR4 ECC SDRAM (PS) | DDR4 SDRAM (PL) | Temp. Range | Status |
|---|---|---|---|---|---|
| ME-XU8-4CG-1E-D11E | XCZU4CG-1FBVB900E | 2GB | 1GB | 0..+85°C | |
| ME-XU8-5EV-1I-D12E | XCZU5EV-1FBVB900I | 4GB | 2GB | -40..+85°C | |
| ME-XU8-7EV-1E-D11E | XCZU7EV-1FBVB900E | 2GB | 1GB | 0..+85°C | |
| ME-XU8-7EV-2I-D12E | XCZU7EV-2FBVB900I | 4GB | 2GB | -40..+85°C | |
| Custom Models | Click to view custom models options | ||||
Click on table to enlarge
Minimum order quantities apply for custom module configurations. Please contact us.
Get a Success Package and Decrease Your Development Time
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Bronze
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EUR 1000.-
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Silver
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EUR 2000.-
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Gold
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EUR 5000.-
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Platin
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EUR 9000.-
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Pricing
Show prices in: EUR USD CHF CNY
| Product Code | Preferred model1 | EUR | USD | CHF | We provide CNY prices with 13% VAT, please contact our China sales. | ||||
|---|---|---|---|---|---|---|---|---|---|
| 1+ | 30+ | 1+ | 30+ | 1+ | 30+ | 我们在中国有分公司,提供人民币含税价,请联系sales.cn@enclustra.com | |||
| ME-XU8-4CG-1E-D11E | ✔ | 993 | 906 | 1149 | 1048 | 900 | 821 | ||
| ME-XU8-5EV-1I-D12E | 2037 | 1917 | 2407 | 2265 | 1853 | 1744 | |||
| ME-XU8-7EV-2I-D12E | ✔ | 2340 | 2203 | 2765 | 2603 | 2129 | 2004 | ||
Click on table to enlarge
1: For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.
Mercury Heat Sink
Large Heat Dissipation
High performance devices like the Xilinx Zynq Ultrascale+ MPSoC or Altera Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.
The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.
The Mercury heat sink is provided as part of a heat sink kit including:
- Heat sink body
- Mounting material
- Standard fan
- Gap pad set
Base Boards
Select one of these base boards to get started with development straight out of the box.
| Base Board | Description |
|---|---|
| Mercury+ ST1 | A flexible board optimized for video applications and the perfect fit for our Mercury and Mercury+ modules. |
| Mercury+ PE3 | a versatile PCIe® base board equipped with a multitude of I/O interfaces compatible with all Mercury and Mercury+ modules. Especially suited for high-speed communication applications thanks to the QSFP+/SFP+ interfaces. |
| Mercury+ PE1 | A feature-packed board with 3 different variants, compatible with all Mercury and Mercury+ modules. |
Warning: Due to the pinout assignments (pin types and I/O voltage levels) on module connectors B and C, affecting the FMC interfaces, the compatibility of the Mercury+ XU8 SoC module to the Mercury+ PE1 base board is limited. It is recommended to check the FMC card pinout in detail with the Enclustra Mercury Master Pinout and with the module and base board schematics.
Operating System Support
| OS | Details | Linux BSP |
|---|---|---|
Linux |
|
Available now |
Target Applications
- Embedded Computing
- Data Acquisition
- High-Speed Communications
- Drive/Motion Control
- Digital Signal Processing
- Image Processing
Related Products
Ordering
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Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.