The Mercury XU5 system-on-chip (SoC) module combines AMD Zynq™ UltraScale+™ MPSoC-series device with fast DDR4 ECC SDRAM, eMMC flash, quad SPI flash, dual Gigabit Ethernet PHY, dual USB 3.0 and thus forms a complete and powerful embedded processing system.
Highlights
Built around AMD Zynq™ UltraScale+™ MPSoC
Two independent memory channels for PS (DDR4 ECC SDRAM) and PL (DDR4 SDRAM)
Up to 24 GByte/sec memory bandwidth
Offers PCIe® Gen3 x4, PCIe Gen2 x4, 2x USB 3.0 and 2x Gigabit Ethernet interfaces
Available in industrial temperature range
Two 168-pin Hirose FX10 connectors with 178 user I/Os
A complete and powerful embedded processing system in a compact, space-saving form factor
Large, high-bandwidth memory, with up to 8 GByte of DDR4 ECC SDRAM (PS) and up to 2 GByte of DDR4 RAM (PL)
High-bandwidth data transfer: PCIe® Gen3 x4, PCIe Gen2 x4 interfaces, and USB 3.0
Lowest power consumption due to the high-efficiency DC/DC converters
Support for Linux embedded operating system
Features
AMD Zynq™ Ultrascale+™ MPSoC
ARM® dual-/quad-core Cortex™-A53
(64 bit, up to 1500 MHz)
ARM dual-core Cortex™-R5
(32 bit, up to 600 MHz)
Mali-400MP2 GPU (only for EG/EV models)
H.264 / H.265 Video Codec (only for EV models
16nm FinFET+ FPGA fabric
Up to 8 GB DDR4 ECC SDRAM (PS)
Up to 2 GB DDR4 SDRAM (PL)
64 MB QSPI flash
16 GB eMMC flash
PCIe® Gen3 ×4 and PCIe® Gen2 ×4
Up to 8 × 6/12.5 Gbit/sec MGT
2 × Gigabit Ethernet
2 × USB 3.0
2 × USB 2.0 (host & host/device)
Up to 256,000 LUT4-eq
178 user I/Os
ZU2CG/ZU2EG/ZU3EG:
14 ARM peripherals
144 FPGA I/Os
20 MGT signals (clock and data)
ZU4CG/ZU4EV/ZU5EV:
14 ARM peripherals
124 FPGA I/Os
40 MGT signals (clock and data)
5 to 15 V single supply
Small form factor (56 × 54 mm)
Module Architecture
Click image to enlarge
Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.
Product Selection Matrix
Product Code
MPSoC
DDR4 ECC SDRAM (PS)
DDR4 SDRAM (PL)
Temp. Range
Status
ME-XU5-2CG-1E-D10H1
XCZU2CG-1SFVC784E
1GB (no ECC)
512MB
0..+85°C
ME-XU5-2EG-1I-D11E
XCZU2EG-1SFVC784I
2GB
512MB
-40..+85°C
ME-XU5-3EG-2I-D11E
XCZU3EG-2SFVC784I
2GB
512MB
-40..+85°C
ME-XU5-4EV-1I-D11E
XCZU4EV-1SFVC784I
2GB
512MB
-40..+85°C
ME-XU5-4EV-1I-D11E-G12
XCZU4EV-1SFVC784I
2GB
512MB
-40..+85°C
ME-XU5-5EV-2I-D12E
XCZU5EV-2SFVC784I
4GB
1GB
-40..+85°C
ME-XU5-5EV-2I-D12E-G12
XCZU5EV-2SFVC784I
4GB
1GB
-40..+85°C
Custom Models
Click to view custom models options
TBC
TBC
TBC
Click on table to enlarge
1: This model supports only half of the DDR4 bandwidth on the PS side (32-bit interface instead of 64-bit).
2: G1 model offered for migration purposes or for cases where the end application does not require GTR transceivers, but
instead more regular I/Os. It can be used when porting an existing design from Mercury ZX1 or ZX5 to Mercury XU5 SoC module.
Please refer to the user manual for details on assembly options and migration guidelines. This model was referred to as “X1” model in previous user manual versions.
Key:
Active
Early Access
Contact us
Minimum order quantities apply for custom module configurations. Please contact us.
We provide CNY prices with 13% VAT, please contact our China sales.
1+
30+
1+
30+
1+
30+
我们在中国有分公司,提供人民币含税价,请联系sales.cn@enclustra.com
ME-XU5-2CG-1E-D10H
✔
442
389
456
401
429
377
ME-XU5-2EG-1I-D11E
✔
521
488
537
503
506
474
ME-XU5-3EG-2I-D11E
✔
807
755
832
779
783
733
ME-XU5-4EV-1I-D11E
✔
1014
859
1046
886
983
833
ME-XU5-4EV-1I-D11E-G1
✔
1014
859
1046
886
983
833
ME-XU5-5EV-2I-D12E
✔
1434
1214
1479
1252
1391
1178
ME-XU5-5EV-2I-D12E-G1
1434
1214
1479
1252
1391
1178
Click on table to enlarge
1: For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.
Mercury Heat Sink
Large Heat Dissipation
High performance devices like the AMD Zynq™ Ultrascale+™ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.
The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.
The Mercury heat sink is provided as part of a heat sink kit including:
Heat sink body
Mounting material
Standard fan
Gap pad set
Design-in Kit – The Fast Way to the Market
The Enclustra Design-in Kits help shorten time-to-market for any AMD Zynq™ UltraScale+™ MPSoC based application.
The design-in kits include everything you need to get started, also 2 AI example applications with all sources.
The examples are based on ResNet50 and AMD Vitis™ Software Platform. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself.
more
Base Boards
Select one of these base boards to get started with development straight out of the box.
a versatile PCIe® base board equipped with a multitude of I/O interfaces compatible with all Mercury and Mercury+ modules. Especially suited for high-speed communication applications thanks to the QSFP+/SFP+ interfaces.
Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.
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