Mercury+ XU1

Xilinx® Zynq® UltraScale+ MPSoC Module

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Mercury+ XU1 SoC Module Mercury+ XU1 SoC Module (Front)
Mercury+ XU1 SoC Module (Back)

Overview

The Mercury+ XU1 system-on-chip (SoC) module combines Xilinx's Zynq UltraScale+™ MPSoC-series device with fast DDR4 ECC SDRAM, eMMC flash, quad SPI flash, dual Gigabit Ethernet PHY, dual USB 3.0 and thus forms a complete and powerful embedded processing system.

  

Highlights

  • Built around Xilinx's Zynq Ultrascale+™ MPSoC
  • DDR4 SDRAM with Error Correction Code (ECC)
  • 19.2 GByte/sec memory bandwidth
  • Offers PCIe® Gen2 x4, 2x USB 3.0 and 2x Gigabit Ethernet interfaces
  • Available in industrial temperature range
  • Three 168-pin Hirose FX10 connectors with 294 user I/Os
  • Linux BSP and tool chain available
  • Powerful and compact FPGA board

Benefits

  • A complete and powerful embedded processing system in a compact, space-saving form factor
  • Large, high-bandwidth memory, with up to 8 GByte of DDR4 ECC SDRAM
  • High-bandwidth data transfer: PCIe® Gen2 x4 interface, and a high number of available LVDS pairs provide high-speed data I/O at low integration cost
  • Lowest power consumption due to the high-efficiency DC/DC converters
  • Support for Linux operating system
  

Features

  • Xilinx® Zynq Ultrascale+™ MPSoC
    • ARM® dual-/quad-core Cortex™-A53
      (64 bit, up to 1500 MHz)
    • ARM dual-core Cortex™-R5
      (32 bit, up to 600 MHz)
    • Mali-400MP2 GPU
    • 16nm FinFET+ FPGA fabric
  • Up to 8 GB DDR4 ECC SDRAM
  • 64 MB QSPI flash
  • 16 GB eMMC flash
  • PCIe® Gen2 ×4
  • Up to 20 × 6/12.5/15 Gbit/sec MGT
  • 2 × Gigabit Ethernet
  • 2 × USB 3.0
  • 2 × USB 2.0 (host & host/device)
  • Up to 747,000 LUT4-eq
  • 294 user I/Os
    • 14 ARM peripherals
    • Up to 200 FPGA I/Os
    • Up to 100 MGT signals (clock and data)
  • 5 to 15 V single supply
  • Small form factor (74 × 54 mm)

Module Architecture

Show module model: XU1 - XU1-G11

Mercury+ XU1 Module ArchitectureClick image to enlarge

Mercury+ XU1 Module ArchitectureClick image to enlarge

1: G1 models offer 4 additional MGTs and 20 regular I/Os less.

Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.

Product Selection Matrix

Product Code MPSoC DDR4
SDRAM		 DDR4
ECC 		GTH
MGTs 		Temp. Range Status
ME-XU1-6CG-1E-D11E-G1 XCZU6CG-
1FFVC900E		 2GB ✔ 16 0..+85°C
ME-XU1-6CG-1E-D11E XCZU6CG-
1FFVC900E		 2GB ✔ 12 0..+85°C no match
ME-XU1-6EG-1I-D11E-G1 XCZU6EG-
1FFVC900I		 2GB ✔ 16 -40..+85°C else
ME-XU1-6EG-1I-D11E XCZU6EG-
1FFVC900I		 2GB ✔ 12 -40..+85°C
ME-XU1-9EG-1E-D11E-G1 XCZU9EG-
1FFVC900E		 2GB ✔ 16 0..+85°C no match
ME-XU1-9EG-2I-D12E XCZU9EG-
2FFVC900I		 4GB ✔ 12 -40..+85°C else
ME-XU1-9EG-2I-D12E-G1 XCZU9EG-
2FFVC900I		 4GB ✔ 16 -40..+85°C else
ME-XU1-9EG-3E-D12E XCZU9EG-
3FFVC900E		 4GB ✔ 12 0..+85°C else
ME-XU1-15EG-1E-D12E-G1 XCZU15EG-
1FFVC900E		 4GB ✔ 16 0..+85°C
ME-XU1-15EG-2I-D12E XCZU15EG-
2FFVC900I		 4GB ✔ 12 -40..+85°C
ME-XU1-15EG-2I-D12E-G1 XCZU15EG-
2FFVC900I		 4GB ✔ 16 -40..+85°C else
Custom Models Click to view custom models options
TBC
TBC TBC TBC

Click on table to enlarge

G1 models offer 4 additional MGTs and 20 regular I/Os less.

Key: in-stock Active limited-quantities Early Access contact-us Contact us

Minimum order quantities apply for custom module configurations. Please contact us.

Pricing

Show prices in: EUR USD CHF CNY

Product CodePreferred model1EURUSDCHFWe provide CNY prices with 13% VAT, please contact our China sales.
1+30+100+1000+10000+1+30+100+1000+10000+1+30+100+1000+10000+ 我们在中国有分公司，提供人民币含税价，请联系kiddy.xu@enclustra.com
ME-XU1-6CG-1E-D11E-G1 ✔ 104784470462252010808717266425361016819683604504
ME-XU1-6CG-1E-D11E104784470462252010808717266425361016819683604504
ME-XU1-6EG-1I-D11E-G11470124410759798301516128311091010856142612071043950805
ME-XU1-6EG-1I-D11E ✔ 1470124410759798301516128311091010856142612071043950805
ME-XU1-9EG-1E-D11E-G11548127410799738121597131411131004838150212361047944788
ME-XU1-9EG-2I-D12E228818831596145612232360194216461502126222201826154814131187
ME-XU1-9EG-2I-D12E-G1228818831596145612232360194216461502126222201826154814131187
ME-XU1-9EG-3E-D12E236121722008176314742436224120711819152122912108194817111431
ME-XU1-15EG-1E-D12E-G1 ✔ 201117021473135411802074175615201397121719511652143013141145
ME-XU1-15EG-2I-D12E ✔ 239922072040179215532475227721041849160223282142197917391507
ME-XU1-15EG-2I-D12E-G1239922072040179215532475227721041849160223282142197917391507

Click on table to enlarge

1: For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.

Mercury Heat Sink
enclustra mercury heat sink hs3

Large Heat Dissipation

High performance devices like the Xilinx Zynq Ultrascale+ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.

The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.

The Mercury heatsink is provided as part of a heatsink accessory package including:

  • Heatsink body
  • Mounting material
  • Standard fan
  • Gap pad set

Design-in Kit – The Fast Way to the Market
enclustra design-in kit xu5

The Enclustra Design-in Kits help shorten time-to-market for any Xilinx Zynq UltraScale+ MPSoC based application. The design-in kits include everything you need to get started, also 2 AI example applications with all sources.

The examples are based on ResNet50 and Xilinx Vitis AI. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself. more

Base Boards

Select one of these base boards to get started with development straight out of the box.

Base BoardDescription
Mercury+ ST1 A flexible board optimized for video applications and the perfect fit for our Mercury and Mercury+ modules.
Mercury+ PE3 a versatile PCIe® base board equipped with a multitude of I/O interfaces compatible with all Mercury and Mercury+ modules. Especially suited for high-speed communication applications thanks to the QSFP+/SFP+ interfaces.
Mercury+ PE1 A feature-packed board with 3 different variants, compatible with all Mercury and Mercury+ modules.
 

Operating System Support

OS Details EBE BSP Petalinux BSP

linux

Linux

 Available now Available now

Target Applications

  • Embedded Computing
  • Data Acquisition
  • High-Speed Communications
  • Drive/Motion Control
  • Digital Signal Processing
  • Image Processing
   

Related Products

  • Mercury+ ST1 Base Board more
  • Mercury+ PE1 PCIe Base Board more
  • Universal Drive Controller IP Core more


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Support and Further Information
Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.