The Mercury+ XU1 system-on-chip (SoC) module combines AMD Zynq™ UltraScale+™ MPSoC-series
device with fast DDR4 ECC SDRAM, eMMC flash, quad SPI flash, dual Gigabit Ethernet PHY, dual USB 3.0
and thus forms a complete and powerful embedded processing system.
Highlights
Built around AMD Zynq™ Ultrascale+™ MPSoC
DDR4 SDRAM with Error Correction Code (ECC)
19.2 GByte/sec memory bandwidth
Offers PCIe® Gen2 x4, 2x USB 3.0 and 2x Gigabit Ethernet interfaces
Available in industrial temperature range
Three 168-pin Hirose FX10 connectors with 294 user I/Os
A complete and powerful embedded processing system in a compact, space-saving form factor
Large, high-bandwidth memory, with up to 8 GByte of DDR4 ECC SDRAM
High-bandwidth data transfer: PCIe® Gen2 x4 interface, and a high number of available LVDS
pairs provide high-speed data I/O at low integration cost
Lowest power consumption due to the high-efficiency DC/DC converters
Support for Linux operating system
Features
AMD Zynq™ Ultrascale+™ MPSoC
ARM® dual-/quad-core Cortex™-A53
(64 bit, up to 1500 MHz)
ARM dual-core Cortex™-R5
(32 bit, up to 600 MHz)
Mali-400MP2 GPU
16nm FinFET+ FPGA fabric
Up to 8 GB DDR4 ECC SDRAM
64 MB QSPI flash
16 GB eMMC flash
PCIe® Gen2 ×4
Up to 20 × 6/12.5/15 Gbit/sec MGT
2 × Gigabit Ethernet
2 × USB 3.0
2 × USB 2.0 (host & host/device)
Up to 747,000 LUT4-eq
294 user I/Os
14 ARM peripherals
Up to 200 FPGA I/Os
Up to 100 MGT signals (clock and data)
5 to 15 V single supply
Small form factor (74 × 54 mm)
Coating and Burn-In for Enhanced Realibility
Coating and burn-in enhances the reliability and longevity of Enclustra SOMs. The protective coating shields the SOM from environmental stressors like dust, moisture, and chemicals, ensuring optimal performance in harsh conditions. Additionally, the rigorous burn-in process identifies and mitigates potential early-life failures by subjecting each unit to extended periods of thermal stress. These services guarantee superior durability and consistent functionality for critical applications. Please contact us for more information.
Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.
We provide CNY prices with 13% VAT, please contact our China sales.
1+
30+
100+
1000+
10000+
1+
30+
100+
1000+
10000+
1+
30+
100+
1000+
10000+
我们在中国有分公司，提供人民币含税价，请联系sales.cn@enclustra.com
ME-XU1-6CG-1E-D11E-G1
✔
1151
928
774
684
572
1188
958
798
706
589
1117
900
751
664
554
ME-XU1-6CG-1E-D11E
1151
928
774
684
572
1188
958
798
706
589
1117
900
751
664
554
ME-XU1-6EG-1I-D11E-G1
1617
1368
1182
1076
913
1667
1411
1219
1111
941
1568
1327
1147
1045
885
ME-XU1-6EG-1I-D11E
✔
1617
1368
1182
1076
913
1667
1411
1219
1111
941
1568
1327
1147
1045
885
ME-XU1-9EG-1E-D11E-G1
1702
1401
1186
1070
893
1756
1445
1224
1104
921
1652
1359
1151
1038
866
ME-XU1-9EG-3E-D12E
2597
2389
2208
1939
1621
2679
2465
2278
2000
1673
2520
2318
2142
1882
1574
ME-XU1-15EG-1E-D12E-G1
✔
2212
1872
1620
1489
1298
2281
1931
1672
1536
1338
2146
1817
1573
1445
1259
ME-XU1-15EG-2I-D12E
✔
2638
2427
2244
1971
1708
2722
2504
2314
2033
1762
2560
2356
2176
1912
1657
ME-XU1-15EG-2I-D12E-G1
2638
2427
2244
1971
1708
2722
2504
2314
2033
1762
2560
2356
2176
1912
1657
Click on table to enlarge
1: For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.
Mercury Heat Sink
Large Heat Dissipation
High performance devices like the AMD Zynq™ Ultrascale+™ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.
The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.
The Mercury heatsink is provided as part of a heatsink accessory package including:
Heatsink body
Mounting material
Standard fan
Gap pad set
Base Boards
Select one of these base boards to get started with development straight out of the box.
a versatile PCIe® base board equipped with a multitude of I/O interfaces compatible with all Mercury and Mercury+ modules. Especially suited for high-speed communication applications thanks to the QSFP+/SFP+ interfaces.
Information contained on this web page is subject to change without notice. Actual product may
differ in appearance from images shown on this web page.
For commercial reasons, this file is only available to Enclustra customers - if you're already a customer, simply fill in your name, company and email address below and we'll send you the file as soon as possible (usually within 24 hours).
If you're not currently a customer, we'd appreciate if you could provide a short message about your project requirements, and anything else we can assist you with.
Document Request
After filling out your contact details you will get an Email with a
download link.
If you're not currently a customer, we'd appreciate if you could provide a
short message about your project requirements, and anything else we can
assist you with.
Need help with your FPGA/SoC design?
Active
Early Access
Contact us
