Mercury SA1

Intel® Cyclone® V SoC Module

Mercury SA1 SoC Module Mercury SA1 SoC Module (Front)
Mercury SA1 SoC Module (Back)

NOT RECOMMENDED FOR NEW DESIGNS

This product is not recommended for new designs. The product remains in mass production until further notice. Please contact us for more information.

Upgrade to the Mercury+ SA2

If you want to upgrade your current Mercury SA1 solution, then have a look at the Mercury+ SA2.

Overview

The Mercury SA1 system-on-chip (SoC) module combines Intel's Cyclone V ARM Processor-based SoC FPGA with fast DDR3 SDRAM, eMMC flash, quad SPI flash, a Gigabit Ethernet PHY and an RTC and thus forms a high-performance embedded processing solution, combining the flexibility of a CPU system with the raw, real-time parallel processing power of an FPGA.

 

Highlights

  • Built around the Intel Cyclone® V ARM® Processor-based SoC FPGA
  • Offers USB 2.0, PCIe® x4 and Gigabit Ethernet interfaces
  • Available in industrial-grade temperature range
  • Smaller than a credit card
  • Linux BSP and tool chain available
  • Powerful and compact FPGA board
Enclustra Design Services

Benefits

  • A complete and powerful embedded processing system in a compact, space-saving form factor
  • Large, high-bandwidth memory, with up to 2 GByte of DDR3L SDRAM
  • High-bandwidth data transfer: PCIe® x4 interface, and a high number of available LVDS pairs provide high-speed data I/O at low integration cost
  • Lowest power consumption due to the high-efficiency DC/DC converters
  • Support for Linux operating systems
 

Features

  • Intel Cyclone® V ARM® Processor-based SoC FPGA
    • ARM® dual-core Cortex™-A9
      (32 bit, up to 800 MHz)
    • Intel Cyclone V 28nm FPGA fabric
  • Small form factor (56 × 54 mm)
  • 178 user I/Os
    • 134 FPGA I/Os (single-ended, differential)
    • 28 MGT signals (clock and data)
    • 16 ARM peripheral I/Os (SPI, SDIO, CAN, I2C, UART)
  • 6 × 3.125 Gbps MGTs
  • Up to 2 GByte DDR3L SDRAM
  • 16 GB eMMC flash (starting R3)
  • 64 MB QSPI flash
  • PCIe® Gen1 x4
  • Gigabit Ethernet
  • USB 2.0 OTG
  • 2 × CAN, 2 × UART, SPI, 2 × I2C, SDIO/MMC
  • 5 to 15 V supply voltage

Module Architecture

Mercury SA1 Module ArchitectureClick image to enlarge

Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.

Product Selection Matrix

Product CodeSoC FPGADDR3L SDRAMPCIeTemp. RangeStatus
ME-SA1-C6-7I-D10 5CSXFC6C6U23I7N 1GB -40..+85°C
Custom Models Click to view custom models options
TBC
TBC TBC TBC

Click on table to enlarge

Key: in-stock Active limited-quantities Early Access contact-us Contact us

Minimum order quantities apply for custom module configurations. Please contact us.

Pricing

Show prices in: EUR USD CHF CNY

Product CodePreferred model1EURUSDCHFWe provide CNY prices with 13% VAT, please contact our China sales.
1+30+100+1000+10000+1+30+100+1000+10000+1+30+100+1000+10000+ 我们在中国有分公司,提供人民币含税价,请联系sales.cn@enclustra.com
ME-SA1-C6-7I-D10459423376306234474436388316242445410365298227

Click on table to enlarge

1: For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.

Mercury Heat Sink

enclustra mercury heat sink hs3

Large Heat Dissipation

High performance devices like the AMD Zynq™ Ultrascale+™ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.

The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.

The Mercury heatsink is provided as part of a heatsink accessory package including:

  • Heatsink body
  • Mounting material
  • Standard fan
  • Gap pad set

Design-in Kit – The Fast Way to the Market

enclustra design-in kit xu5

The Enclustra Design-in Kits help shorten time-to-market for any AMD Zynq™ UltraScale+™ MPSoC based application. The design-in kits include everything you need to get started, also 2 AI example applications with all sources.

The examples are based on ResNet50 and AMD Vitis™ Software Platform. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself. more

Base Boards

Select one of these base boards to get started with development straight out of the box.

Base BoardDescription
Mercury+ ST1 A flexible board optimized for video applications and the perfect fit for our Mercury and Mercury+ modules.
Mercury+ PE3 a versatile PCIe® base board equipped with a multitude of I/O interfaces compatible with all Mercury and Mercury+ modules. Especially suited for high-speed communication applications thanks to the QSFP+/SFP+ interfaces.
Mercury+ PE1 A feature-packed board with 3 different variants, compatible with all Mercury and Mercury+ modules.
 

Operating System Support

OS Details Availability

linux

Linux

Available now

Target Applications

  • Embedded Computing
  • Data Acquisition
  • High-Speed Communications
  • Drive/Motion Control
  • Digital Signal Processing
  • Image Processing
  

Related Products

  • Mercury+ ST1 Base Board more
  • Mercury+ PE1 PCIe Base Board more
  • Universal Drive Controller IP Core more


Ordering

 

Support and Further Information


Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.