The Mercury SA1 system-on-chip (SoC) module combines Intel's Cyclone V ARM Processor-based SoC FPGA with fast DDR3 SDRAM, eMMC flash, quad SPI flash, a Gigabit Ethernet PHY and an RTC and thus forms a high-performance embedded processing solution, combining the flexibility of a CPU system with the raw, real-time parallel processing power of an FPGA.
Highlights
Built around the Intel Cyclone® V ARM® Processor-based SoC FPGA
Offers USB 2.0, PCIe® x4 and Gigabit Ethernet interfaces
A complete and powerful embedded processing system in a compact, space-saving form factor
Large, high-bandwidth memory, with up to 2 GByte of DDR3L SDRAM
High-bandwidth data transfer: PCIe® x4 interface, and a high number of available LVDS pairs provide high-speed data I/O at low integration cost
Lowest power consumption due to the high-efficiency DC/DC converters
Support for Linux operating systems
Features
Intel Cyclone® V ARM® Processor-based SoC FPGA
ARM® dual-core Cortex™-A9
(32 bit, up to 800 MHz)
Intel Cyclone V 28nm FPGA fabric
Small form factor (56 × 54 mm)
178 user I/Os
134 FPGA I/Os (single-ended, differential)
28 MGT signals (clock and data)
16 ARM peripheral I/Os (SPI, SDIO, CAN, I2C, UART)
6 × 3.125 Gbps MGTs
Up to 2 GByte DDR3L SDRAM
16 GB eMMC flash (starting R3)
64 MB QSPI flash
PCIe® Gen1 x4
Gigabit Ethernet
USB 2.0 OTG
2 × CAN, 2 × UART, SPI, 2 × I2C, SDIO/MMC
5 to 15 V supply voltage
Module Architecture
Click image to enlarge
Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.
Product Selection Matrix
Product Code
SoC FPGA
DDR3L SDRAM
PCIe
Temp. Range
Status
ME-SA1-C6-7I-D10
5CSXFC6C6U23I7N
1GB
✔
-40..+85°C
Custom Models
Click to view custom models options
TBC
TBC
TBC
TBC
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Key:
Active
Early Access
Contact us
Minimum order quantities apply for custom module configurations. Please contact us.
We provide CNY prices with 13% VAT, please contact our China sales.
1+
30+
100+
1000+
10000+
1+
30+
100+
1000+
10000+
1+
30+
100+
1000+
10000+
我们在中国有分公司,提供人民币含税价,请联系kiddy.xu@enclustra.com
ME-SA1-C6-7I-D10
✔
418
385
342
279
213
431
397
353
288
220
405
373
332
271
207
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1: For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.
Mercury Heat Sink
Large Heat Dissipation
High performance devices like the Xilinx Zynq Ultrascale+ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.
The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.
The Mercury heatsink is provided as part of a heatsink accessory package including:
Heatsink body
Mounting material
Standard fan
Gap pad set
Design-in Kit – The Fast Way to the Market
The Enclustra Design-in Kits help shorten time-to-market for any Xilinx Zynq UltraScale+ MPSoC based application.
The design-in kits include everything you need to get started, also 2 AI example applications with all sources.
The examples are based on ResNet50 and Xilinx Vitis AI. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself.
more
Base Boards
Select one of these base boards to get started with development straight out of the box.
a versatile PCIe® base board equipped with a multitude of I/O interfaces compatible with all Mercury and Mercury+ modules. Especially suited for high-speed communication applications thanks to the QSFP+/SFP+ interfaces.
Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.
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