The excitement is building as we gear up for Embedded World 2026, the industry’s leading event for embedded systems. Get ready for the Enclustra immersive experience packed with breakthrough technologies, live partner demos, and hands-on innovation. Mark your calendars and visit us!

This year, we’re showcasing breakthrough solutions engineered for exceptional performance, speed, and reliability. Step into our interactive Product Wall and explore Enclustra’s latest FPGA and SoC modules.

• Andromeda XRU50 RFSoC and XRU30 – The Ultimate RF Powerhouses
  Experience scalable RF system design with the Andromeda XRU50 and the new XRU30 RFSoC. The XRU50 targets large-scale wireless and advanced phased-array radar systems, while the XRU30 enables compact, power-efficient solutions for telecom, 5G, and satellite communications. Compare their capabilities in our Comparison Infographic.
• Brand-New: EAP Kits and Baseboards – Accelerate Development
  Be among the first to check our latest EAP Kits and Baseboards, designed to accelerate development, simplify integration, and bring your projects to life faster than ever before.
• Brand-New: SiMa Dev Kit – Powering Physical AI
  Discover the SiMa Dev Kit, developed in partnership with SiMa.ai, delivering high-performance, energy-efficient Edge AI and computer vision for robotics, smart vision, healthcare, automotive, and more.
• Andromeda XVE70 – Powered by AMD Versal™ SoC
  Experience advanced AI acceleration, high-speed vision, signal processing, and edge computing with the Andromeda XVE70, designed for AI inference at the edge, next-gen communications, secure industrial control, and automotive ADAS applications.
• Andromeda IAE50 – Built Around Altera Agilex 5 E-Series
  Designed around Altera’s Agilex 5 E-Series SoC, this module is a game-changer for industrial automation, vision systems, and high-performance computing. Discover how it drives efficiency across industries.
• Andromeda, Mercury and Mars Families – Powering Every Application
  From ultra-low-latency, real-time performance with the Andromeda Family, to low-power, high-speed connectivity with the Mercury Family, including the new Mercury+ XU61, and the exceptional versatility of the Mars Family, our portfolio delivers scalable, high-performance solutions for everything from automotive and aerospace to satellite communications, sensing, and embedded computing.
• VPX/VNX+ Solutions – Ruggedized and reliable
  Discover how our ruggedized solutions deliver high reliability and performance in harsh environments and protect the modules from shock, vibration, and extreme temperatures.

Guest Demos: Technology That Inspires, Transforms, and Saves Lives

A proud milestone for Enclustra!

We are thrilled to announce the launch of Enclustra Asia, our new Operations Centre of Excellence in Singapore. The event marked the official launch of our regional headquarters in Singapore — a strategic expansion into Southeast Asia’s advanced manufacturing and innovation landscape, with a strong focus on talent acquisition and collaboration.

The initiatives that we are bringing are expected to contribute up to US$100 million annually to Singapore’s manufacturing ecosystem within the next three to four years, further reinforcing the nation’s position as a global hub for deep-tech talent and smart manufacturing.

“Enclustra’s purpose has always been clear: to enable innovation that is life-saving, life-changing, and dream-making in terms of the impact on human lives,” said Phillip Bächtold, CEO of Enclustra. “Our expansion to Singapore and collaboration with Singapore universities mark the next step in that journey. We’re not just advancing hardware; we’re enabling the ideas that define tomorrow.”

Ms Cindy Koh, Executive Vice President at the Singapore Economic Development Board (EDB), added: “Singapore offers a vibrant, advanced manufacturing ecosystem for global companies looking to expand into Asia and scale innovative solutions to international markets. Enclustra’s latest investment brings new FPGA-based solutions that will strengthen Singapore’s advanced manufacturing sector, creating more partnership opportunities for our local enterprises and adding 100 skilled roles here.”

H.E. Mr. Frank Grütter, Ambassador of Switzerland to Singapore, said: “Enclustra’s investment is more than just an expansion – it also strengthens the partnership between Switzerland and Singapore. I am convinced that it will accelerate the development of the advanced electronics sector in this region and reinforce Switzerland’s reputation for precision, reliability and innovation – characteristics that we share with Singapore.”

Heartfelt thanks to H.E. Mr Frank Grütter, Ms Cindy Koh, and Ms Anne Schalper from SwissCham Singapore for joining us and supporting this important step forward.

In addition, we were honoured to have representatives from Nanyang Technological University, with whom we look forward to working closely as part of our new operations at Enclustra Asia.

Together, we’re shaping the future of reconfigurable computing — right in Singapore.

Read more in the official Press Release

Watch the launch highlights.

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Enclustra, the Swiss-based leader in FPGA innovation with a strong footprint across Europe, the Americas, and Asia, proudly announces the launch of its new Physical AI Technology Line. This milestone builds on the March 2025 announcement at Embedded World, Nuremberg, of Enclustra’s strategic partnership with SiMa.ai and the joint introduction of the MLSoC™ Modalix System-on-Module (SoM), leveraging SiMa.ai’s 50 TOPS MLSoC device.

With industries worldwide accelerating digital transformation, Enclustra’s new product line addresses the growing demand for multi-modal AI, Physical AI, and Generative AI applications at the embedded edge. The Modalix SoM provides a high-performance, energy-efficient solution that enables organizations in manufacturing, robotics, industrial automation, aerospace, and defense to integrate advanced AI capabilities faster, more reliably, and at scale. Customers can place orders immediately to secure early delivery and be among the first to deploy next-generation AI at the embedded edge.

The joint innovation introduces a powerful, compact solution that showcases the best of both companies’ expertise. Enclustra brings its Edge AI know-how and advanced system design together with SiMa.ai’s leadership in Physical AI — creating a unique combination of technologies that sets a new standard for embedded intelligence. Addressing key challenges of platforms at the edge, the new Enclustra - Modalix MLSoM delivers high performance with low power consumption, enabling efficient AI computing across diverse embedded applications where machines must both think and act.

Our joint product is a 50 TOPS purpose-built SoM for Physical AI, which enables larger LLM workloads at under 10 watts of power consumption. It features a pin-compatible form factor with leading GPU SoMs, simplifying system upgrades and integration. It also provides wide I/O flexibility, industrial-grade thermal management, and real-time performance monitoring — ensuring reliability for the most demanding applications. The technology is supported by SiMa.ai’s ONE Platform software, featuring Palette and Edgematic tools for streamlined AI deployment in familiar development environments such as Python, PyTorch, and OpenCV.

Designed for industries undergoing rapid digital transformation — including manufacturing, robotics, aerospace, defense, and industrial automation — the Physical AI line accelerates innovation in smart robotics, predictive maintenance, AI-enabled controls, and autonomous systems.

“As a pioneer in high-performance embedded solutions, Enclustra is committed to pushing the boundaries of FPGA and SoM innovation,” said Philipp Baechtold, CEO of Enclustra. “With Swiss innovation at our core and a growing presence across global markets, this launch strengthens our ability to deliver Edge AI solutions that empower industries to scale AI adoption efficiently.”

Krishna Rangasayee, CEO of SiMa.ai. Added: “Together with Enclustra, we are removing integration barriers and making it remarkably simple for companies worldwide to upgrade from legacy systems to Modalix’s superior performance.” Engineering samples of the MLSoC Modalix SoM are available now through Enclustra’s exclusive Early Access Program. Organizations worldwide can request participation here:

Learn more and request Early Access

Read more in the official Press Release.

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We're pleased to announce our participation in this year’s FPGA Conference Europe, taking place in Munich this July. As Europe's key event for field-programmable gate array (FPGA) technologies, it brings together the brightest engineers and thought leaders for hands-on insights, proven methodologies, and the latest in embedded design.

This year, we’re putting the spotlight on three highly anticipated technical presentations from our team, each packed with practical strategies and real-world engineering takeaways.

Meet our Experts!

Join the talk with our experts’ technical presentations that reflect our ongoing commitment to practical innovation in FPGA development:

• Doubling RFSoC ADC Rate from 5 Gsps to 10 Gsps
  Speaker: Dr. Harry Commin, Lead FPGA/SoC firmware Engineer at Enclustra
  Level: Expert | Date: July 3 | Time: 11:50
  Discover how to digitally combine three ADCs on AMD RFSoC to double the sampling rate - no special analog circuitry required. Includes practical results from a research project on AMD RFSoC.
• Introduction to the VUnit Verification Framework
  Speaker: Oliver Bründler, Staff Engineer at Enclustra
  Level: Beginner | Date: July 2 | Time: 14:15
  A practical introduction to VUnit, the open-source VHDL verification framework. Learn how it simplifies automation, enhances test coverage, and accelerates development workflows.
• Open Logic: Open-Source FPGA Standard Library
  Speaker: Oliver Bründler
  Level: Beginner | Date: July 2 | Time: 17:20
  Explore the benefits of the Open Logic HDL library and how reusable, vendor-independent modules can streamline your FPGA development workflows. We look forward to seeing you in Munich - let’s talk about your next FPGA project.

We look forward to seeing you in Munich - let’s talk about your next FPGA project.

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