Enclustra Expands Technology Line for Physical AI in Partnership with SiMa.ai
Enclustra, the Swiss-based leader in FPGA innovation with a strong footprint across Europe, the Americas, and Asia, proudly announces the launch of its new Physical AI Technology Line. This milestone builds on the March 2025 announcement at Embedded World, Nuremberg, of Enclustra’s strategic partnership with SiMa.ai and the joint introduction of the MLSoC™ Modalix System-on-Module (SoM), leveraging SiMa.ai’s 50 TOPS MLSoC device.
With industries worldwide accelerating digital transformation, Enclustra’s new product line addresses the growing demand for multi-modal AI, Physical AI, and Generative AI applications at the embedded edge. The Modalix SoM provides a high-performance, energy-efficient solution that enables organizations in manufacturing, robotics, industrial automation, aerospace, and defense to integrate advanced AI capabilities faster, more reliably, and at scale. Customers can place orders immediately to secure early delivery and be among the first to deploy next-generation AI at the embedded edge.
The joint innovation introduces a powerful, compact solution that showcases the best of both companies’ expertise. Enclustra brings its Edge AI know-how and advanced system design together with SiMa.ai’s leadership in Physical AI — creating a unique combination of technologies that sets a new standard for embedded intelligence. Addressing key challenges of platforms at the edge, the new Enclustra - Modalix MLSoM delivers high performance with low power consumption, enabling efficient AI computing across diverse embedded applications where machines must both think and act.
Our joint product is a 50 TOPS purpose-built SoM for Physical AI, which enables larger LLM workloads at under 10 watts of power consumption. It features a pin-compatible form factor with leading GPU SoMs, simplifying system upgrades and integration. It also provides wide I/O flexibility, industrial-grade thermal management, and real-time performance monitoring — ensuring reliability for the most demanding applications. The technology is supported by SiMa.ai’s ONE Platform software, featuring Palette and Edgematic tools for streamlined AI deployment in familiar development environments such as Python, PyTorch, and OpenCV.
Designed for industries undergoing rapid digital transformation — including manufacturing, robotics, aerospace, defense, and industrial automation — the Physical AI line accelerates innovation in smart robotics, predictive maintenance, AI-enabled controls, and autonomous systems.
“As a pioneer in high-performance embedded solutions, Enclustra is committed to pushing the boundaries of FPGA and SoM innovation,” said Philipp Baechtold, CEO of Enclustra. “With Swiss innovation at our core and a growing presence across global markets, this launch strengthens our ability to deliver Edge AI solutions that empower industries to scale AI adoption efficiently.”
Krishna Rangasayee, CEO of SiMa.ai. Added: “Together with Enclustra, we are removing integration barriers and making it remarkably simple for companies worldwide to upgrade from legacy systems to Modalix’s superior performance.” Engineering samples of the MLSoC Modalix SoM are available now through Enclustra’s exclusive Early Access Program. Organizations worldwide can request participation here:
Learn more and request Early Access
Read more in the official Press Release.
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