Overview

The Enclustra Andromeda XRU30 RFSoC module combines AMD’s Zynq Ultrascale+ RFSoC FPGA with a large count of RF-DACs and RF-ADCs integrated, enabling direct synthesis of RF signals and high-speed data processing. This eliminates the need for complex analog circuitry. The module offers versatile I/Os, supporting a wide range of standard interfaces. Equipped with ECC memory, eMMC, QSPI flash, integrated Gigabit Ethernet, and USB, the Andromeda XRU30 module is in the most compact form factor available today on the market. This makes it ideal for space-constrained applications while providing remarkable RF performance in an integrated, compact, and power-efficient package for next-generation RF systems.

Highlights

• 8 x RF-ADC up to 5.9 GSPS and 8 x RF-DAC up to 10 GSPS integrated
• Built around AMD’s Zynq Ultrascale+ RFSoC FPGA
  • Quad core Cortex A53 at 1.5GHz
• Available in industrial temperature range
• DDR4 SDRAM with Error Correction Code (ECC)
• Five ADM6-60 Samtec connectors with up to 162 user I/Os
• Linux BSP and tool chain available soon
• Powerful and compact FPGA board
• Offers Gigabit Ethernet, USB2.0 and USB3.0 interface

Benefits

• A complete and powerful RF processing system in a low-power, compact form factor
• Large, high bandwidth memory with up to 8GB of DDR4 ECC SDRAM
• High number of transceivers available
• High number of user I/Os and FPGA logic resources for powerful applications
• Support for Linux operating system

Features

• AMD’s Zynq Ultrascale+ RFSoC FPGA
  • Quad core Cortex A53 at 1.5GHz
• RF: 8 x ADC @ 14 bit up to 5.9 GSPS | 8 x DAC @ 14 bit up to 10 GSPS
• 162 user I/Os:
  • 104 HP (1-1.8V)
  • 36 HD (1.2-3.3V)
  • 22 MIO (1.8-3.3V)
• MGT: 8 PL GTY (32 Gbps) and 4 PS GTR (6 Gbps)
• APU: 4 x Cortex A53 @ 1.5 GHz
• 8 GB DDR4-2400 x72 ECC memory (PS)
• 16 GB eMMC flash (PS)
• 64 MB QSPI flash (PS)
• Gigabit Ethernet PHY
• USB 2.0 PHY (USB 3.0 using PS GTR)
• 12V single supply
• Small form factor Andromeda M 68 x 52 mm

Module Architecture

Click image to enlarge

Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.

Product Selection Matrix

Model Name	FPGA	Memory	Temp. Range	Status
AM-XRU30-65DR-2I-D4E	XCZU65DR-2FSVE1156I	8 GB x72 ECC DDR4-2400	-40..+85°C
AM-XRU30-67DR-2I-D4E	XCZU67DR-2FSVE1156I	8 GB x72 ECC DDR4-2400	-40..+85°C
AM-XRU30-47DR-2I-D4E	XCZU47DR-2FSVE1156I	8 GB x72 ECC DDR4-2400	-40..+85°C
AM-XRU30-42DR-1I-D3E	XCZU67DR-2FSVE1156I	4 GB x72 ECC DDR4-2400	-40..+85°C

Click on table to enlarge

Key: Active Early Access Contact us

Minimum order quantities apply for custom module configurations. Please contact us.

Pricing

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Recommended accessories

Neso RF Frontend modules – in development, coming soon.

Baseboard

Operating System Support

Target Applications

• Software defined radios (5G wireless communications)
• Phased array radar
• Test and measurement
• Quantum computing

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