Mercury+ XU6

Xilinx® Zynq® UltraScale+ MPSoC Module

Mercury+ XU6 FPGA Module Mercury+ XU6 FPGA Module (front)
Mercury+ XU6 FPGA Module (back)

Xilinx® Zynq® UltraScale+ MPSoC Module


The Mercury+ XU6 system-on-chip (SoC) module combines Xilinx's Zynq UltraScale+™ MPSoC-series device with fast DDR4 ECC SDRAM, eMMC flash, quad SPI flash, Gigabit Ethernet PHY, dual USB 3.0 and thus forms a complete and powerful embedded processing system.


  • Built around Xilinx's Zynq Ultrascale+™ MPSoC
  • DDR4 SDRAM with Error Correction Code (ECC)
  • Up to 19.2 GByte/sec memory bandwidth
  • Offers PCIe® Gen3 x4, PCIe Gen2 x4, 2x USB 3.0 and Gigabit Ethernet interfaces
  • Available in industrial temperature range
  • Three 168-pin Hirose FX10 connectors with up to 294 user I/Os
  • Linux BSP and tool chain available
  • Powerful and compact FPGA board
Enclustra Design Services


  • A complete and powerful embedded processing system in a compact, space-saving form factor
  • Large, high-bandwidth memory, with up to 8 GByte of DDR4 ECC SDRAM
  • High-bandwidth data transfer: PCIe® Gen3 x4, PCIe Gen2 x4 interfaces, and USB 3.0
  • Lowest power consumption due to the high-efficiency DC/DC converters
  • Support for Linux embedded operating system


  • Xilinx® Zynq Ultrascale+™ MPSoC
    • ARM® dual-/quad-core Cortex™-A53
      (64 bit, up to 1333 MHz)
    • ARM dual-core Cortex™-R5
      (32 bit, up to 533 MHz)
    • Mali-400MP2 GPU (only for EG/EV models)
    • H.264 / H.265 Video Codec (only for EV models)
    • 16nm FinFET+ FPGA fabric
  • Up to 8 GB DDR4 ECC SDRAM (PS side)
  • 16 GB eMMC flash
  • 64 MB QSPI flash
  • Up to 8 × 6/12.5 Gbps MGT
  • PCIe Gen2 ×4
  • PCIe® Gen3 ×4 (only devices larger than ZU3)
  • Gigabit Ethernet
  • 2× USB 2.0/3.0 (host & host/device) or alternatively 1× USB 2.0 OTG
  • Up to 256,000 system logic cells
  • Up to 294 user I/Os
    • ZU2CG/ZU2EG/ZU3EG:
      • 14 ARM peripherals
      • 240 FPGA I/Os
      • 20 MGT signals (clock and data)
    • ZU4CG/ZU4EV/ZU5EV:
      • 14 ARM peripherals
      • 240 FPGA I/Os
      • 40 MGT signals (clock and data)
  • 5–15 V supply
  • 65 × 54 mm

Module Architecture

Mercury+ XU6 Module ArchitectureClick image to enlarge

1. MGTs and PCIe support only for FPGA devices larger than ZU3

Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor’s datasheets.
Enclustra maintains an errata and revision history document for each product. Please also check the errata of the FPGA device and other components.

Product Selection Matrix

eMMCTemp. RangeStatus
ME-XU6-2CG-1E-D10H1 XCZU2CG-1SFVC784E 1GB 16GB 0..+85°C
ME-XU6-2EG-1I-D13E XCZU2EG-1SFVC784I 8GB 16GB -40..+85°C
ME-XU6-3EG-2I-D11 XCZU3EG-2SFVC784I 2GB 16GB -40..+85°C else
ME-XU6-4CG-1E-D12 XCZU4CG-1SFVC784E 4GB 16GB 0..+85°C
ME-XU6-4CG-1E-D13 XCZU4CG-1SFVC784E 8GB 16GB 0..+85°C
ME-XU6-4EV-1I-D12E XCZU4EV-1SFVC784I 4GB 16GB -40..+85°C
ME-XU6-5EV-2I-D12E XCZU5EV-2SFVC784I 4GB 16GB -40..+85°C
Custom Models Click to view custom models options

Click on table to enlarge

1: This model supports only half of the DDR4 bandwidth on the PS side (32-bit interface instead of 64-bit).

Key: in-stock Active limited-quantities Early Access contact-us Contact us

Minimum order quantities apply for custom module configurations. Please contact us.


Show prices in: EUR USD CHF CNY

Product CodePreferred model1EURUSDCHFWe provide CNY prices with 13% VAT, please contact our China sales.
1+30+100+1000+10000+1+30+100+1000+10000+1+30+100+1000+10000+ 我们在中国有分公司,提供人民币含税价,请联系

Click on table to enlarge

1: For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock – please get in touch for more details.
All prices are non-binding estimates – please use the enquiry form or contact us for definitive pricing and lead-time information.

Mercury Heat Sink

enclustra mercury heat sink hs3

Large Heat Dissipation

High performance devices like the Xilinx Zynq Ultrascale+ MPSoC or Intel Arria 10 need cooling in most applications: always make sure the FPGA/SoC is adequately cooled.

The Mercury Heat Sink is an optimal cooling solution for Mercury and Mercury+ FPGA and SoC modules – it is low-profile and covers the whole module surface1.

The Mercury heatsink is provided as part of a heatsink accessory package including:

  • Heatsink body
  • Mounting material
  • Standard fan
  • Gap pad set

Design-in Kit – The Fast Way to the Market

enclustra design-in kit xu5

The Enclustra Design-in Kits help shorten time-to-market for any Xilinx Zynq UltraScale+ MPSoC based application. The design-in kits include everything you need to get started, also 2 AI example applications with all sources.

The examples are based on ResNet50 and Xilinx Vitis AI. The ready made binaries as well as the sources are packed with the box – as well as the extensive documentation how to build it yourself. more

Base Boards

Select one of these base boards to get started with development straight out of the box.

Base BoardDescription
Mercury+ ST1 A flexible board optimized for video applications and the perfect fit for our Mercury and Mercury+ modules.
Mercury+ PE3 a versatile PCIe® base board equipped with a multitude of I/O interfaces compatible with all Mercury and Mercury+ modules. Especially suited for high-speed communication applications thanks to the QSFP+/SFP+ interfaces.
Mercury+ PE1 A feature-packed board with 3 different variants, compatible with all Mercury and Mercury+ modules.

Operating System Support

OS Details EBE BSP Petalinux BSP



Available now Available now

Target Applications

  • Embedded Computing
  • Data Acquisition
  • High-Speed Communications
  • Drive/Motion Control
  • Digital Signal Processing
  • Image Processing

Related Products

  • Mercury+ ST1 Base Board more
  • Mercury+ PE1 PCIe Base Board more
  • Universal Drive Controller IP Core more



Support and Further Information

Information contained on this web page is subject to change without notice. Actual product may differ in appearance from images shown on this web page.